XC4VLX25-11FFG676I
XC4VLX25-11FFG676I
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Xilinx

XC4VLX25-11FFG676I


XC4VLX25-11FFG676I
F20-XC4VLX25-11FFG676I
Active
IC FPGA 448 I/O 676FCBGA
676-FCBGA (27x27)

XC4VLX25-11FFG676I ECAD Model


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XC4VLX25-11FFG676I Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-4 LX
Package Tray
Number of LABs/CLBs 2688
Number of Logic Elements/Cells 24192
Total RAM Bits 1327104
Number of I/O 448
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Base Product Number XC4VLX25

XC4VLX25-11FFG676I Datasheet Download


XC4VLX25-11FFG676I Overview



The XC4VLX25-11FFG676I chip is a high-performance, low-power FPGA manufactured by Xilinx. It is a member of the Virtex-4 family of FPGAs, which are designed for high-speed and high-density applications.


The XC4VLX25-11FFG676I chip has a package size of 676-pins and is designed to operate at a maximum frequency of 250MHz. It has a total of 25,000 logic cells and 4,608 Flip-Flops, as well as 8,192 bits of embedded memory. It also has a total of 8 dedicated multipliers and 4 clock-management blocks.


The XC4VLX25-11FFG676I chip is designed for a wide range of applications, including high-speed signal processing, data acquisition, communications, networking, and embedded systems. It is also suitable for applications such as ASIC prototyping, high-density memory, and high-speed interconnects.


The XC4VLX25-11FFG676I chip has a wide range of features, including low-power operation, high-speed data transfer, and low-latency signal processing. It also has a wide range of I/O options, including LVDS, LVPECL, and SSTL. The chip also supports a wide range of development tools, including Xilinx ISE, EDK, and PlanAhead.


Overall, the XC4VLX25-11FFG676I chip is a high-performance, low-power FPGA designed for a wide range of applications. It has a wide range of features and I/O options, as well as a wide range of development tools. It is suitable for applications such as high-speed signal processing, data acquisition, communications, networking, and embedded systems.



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