XC6SLX75-3FGG676I
XC6SLX75-3FGG676I
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Xilinx

XC6SLX75-3FGG676I


XC6SLX75-3FGG676I
F20-XC6SLX75-3FGG676I
Active
IC FPGA 408 I/O 676FBGA
676-FBGA (27x27)

XC6SLX75-3FGG676I ECAD Model


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XC6SLX75-3FGG676I Attributes


Type Description Select
Mfr AMD Xilinx
Series Spartan®-6 LX
Package Tray
Number of LABs/CLBs 5831
Number of Logic Elements/Cells 74637
Total RAM Bits 3170304
Number of I/O 408
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Base Product Number XC6SLX75

XC6SLX75-3FGG676I Datasheet Download


XC6SLX75-3FGG676I Overview



The XC6SLX75-3FGG676I chip model is a cutting-edge technology developed by Xilinx and is widely used in various industries. It is based on the latest 28nm process technology, and is equipped with a low-power, low-cost, high-performance FPGA architecture. It has a wide range of applications, from consumer electronics to industrial automation.

The XC6SLX75-3FGG676I model has a number of advantages that make it a great choice for many applications. It has a large capacity of up to 676K logic cells, 676K Flip-Flops, and 1064 I/O pins. It is also highly reliable and has a long-term availability. This model also offers a wide range of features, such as high-speed transceivers, integrated memory, and high-speed I/O. It also has a low power consumption and supports a variety of programming languages.

The XC6SLX75-3FGG676I model is expected to be in high demand in the future, due to its versatility and cost-effectiveness. It is suitable for a wide range of applications, from consumer electronics to industrial automation. This model is also suitable for the development of advanced communication systems, as it has a wide range of features, such as high-speed transceivers and integrated memory.

The design requirements of the XC6SLX75-3FGG676I model are quite specific. It requires a 28nm process technology and a low-power, low-cost, high-performance FPGA architecture. It also requires a large capacity of up to 676K logic cells, 676K Flip-Flops, and 1064 I/O pins. In addition, it also needs to be highly reliable and have a long-term availability.

Case studies have shown that the XC6SLX75-3FGG676I chip model is a great choice for many applications. It has been used in the development of advanced communication systems, such as Wi-Fi and Bluetooth, as well as in consumer electronics and industrial automation. However, there are some precautions to consider when using this model, such as the need to use the appropriate programming language and the need to ensure that the design requirements are met.

Overall, the XC6SLX75-3FGG676I chip model is a great choice for many applications. It has a wide range of features, a large capacity, and a low power consumption. It is also highly reliable and has a long-term availability. This model is expected to be in high demand in the future, due to its versatility and cost-effectiveness. It is suitable for the development of advanced communication systems, as well as for consumer electronics and industrial automation. However, it is important to ensure that the design requirements are met and the appropriate programming language is used.

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Unit Price: $209.04
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $194.4072 $194.4072
10+ $192.3168 $1,923.1680
100+ $181.8648 $18,186.4800
1000+ $171.4128 $85,706.4000
10000+ $156.7800 $156,780.0000
The price is for reference only, please refer to the actual quotation!

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