XC7K325T-1FFG900CES
XC7K325T-1FFG900CES
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Xilinx

XC7K325T-1FFG900CES


XC7K325T-1FFG900CES
F20-XC7K325T-1FFG900CES
Active
IC FPGA 500 I/O 900FCBGA
900-FCBGA (31x31)

XC7K325T-1FFG900CES ECAD Model


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XC7K325T-1FFG900CES Attributes


Type Description Select
Mfr AMD Xilinx
Series Kintex®-7
Package Tray
Number of LABs/CLBs 25475
Number of Logic Elements/Cells 326080
Total RAM Bits 16404480
Number of I/O 500
Voltage - Supply 0.97V ~ 1.03V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Base Product Number XC7K325T

XC7K325T-1FFG900CES Datasheet Download


XC7K325T-1FFG900CES Overview



The XC7K325T-1FFG900CES is an FPGA (Field Programmable Gate Array) chip model manufactured by Xilinx. It is a member of the Kintex-7 family of FPGAs and is built on a 28nm process. It has 1,536 logic cells, 1.5Mb of block RAM, and 900Kb of distributed RAM. The chip has 8 transceivers, each with a data rate of up to 12.5Gbps, and supports a wide range of I/O standards. It also has a number of clock management features and power management features.


The XC7K325T-1FFG900CES is designed for a variety of applications, including high-speed communication, industrial automation, aerospace and defense, and video and imaging. It is well-suited for applications that require high throughput, low latency, and high reliability, such as 5G networks, data centers, and autonomous vehicles. The chip is also suitable for use in applications that require high-speed data transfer, such as video and image processing, high-speed networking, and storage.


The XC7K325T-1FFG900CES is a reliable, high-performance FPGA chip that offers a wide range of features and capabilities. It is designed for use in a variety of applications, from high-speed communication to industrial automation and aerospace and defense. It is well-suited for applications that require high throughput, low latency, and high reliability.



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