XC7K325T-2FFV900I
XC7K325T-2FFV900I ECAD Model
XC7K325T-2FFV900I Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Kintex®-7 | |
Package | Tray | |
Number of LABs/CLBs | 25475 | |
Number of Logic Elements/Cells | 326080 | |
Total RAM Bits | 16404480 | |
Number of I/O | 500 | |
Voltage - Supply | 0.97V ~ 1.03V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 900-BBGA, FCBGA | |
Supplier Device Package | 900-FCBGA (31x31) |
XC7K325T-2FFV900I Overview
The XC7K325T-2FFV900I is a high-performance, low-power integrated circuit manufactured by Xilinx. It is a Kintex-7 FPGA (Field Programmable Gate Array) device and features a combination of high-speed transceivers, high-speed I/O and a high-performance, low-power Kintex-7 FPGA fabric. It is ideal for applications in the areas of data center, networking, video, and general-purpose FPGA designs.
The XC7K325T-2FFV900I has a total of 325,280 logic cells and a total of 1,496,640 flip-flops. It has 1,536 DSP slices and a total of 3,072 block RAMs. It also features a total of 900 user I/O pins and 8 high-speed transceivers. The device is capable of operating at a maximum frequency of 600MHz and has a maximum power dissipation of 19.6W.
The XC7K325T-2FFV900I is an ideal choice for applications in the areas of data center, networking, video, and general-purpose FPGA designs. It can be used for a wide range of applications such as machine learning, 5G wireless communication, video processing, and data center acceleration. It can also be used for applications such as high-speed networking, high-speed data transfer, and high-speed signal processing. The XC7K325T-2FFV900I is a high-performance, low-power integrated circuit that is ideal for a variety of applications.
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Pricing (USD)
QTY | Unit Price | Ext Price |
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