XC7K325T-2FFV900I
XC7K325T-2FFV900I
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Xilinx

XC7K325T-2FFV900I


XC7K325T-2FFV900I
F20-XC7K325T-2FFV900I
Active
IC FPGA 500 I/O 900FCBGA
900-FCBGA (31x31)

XC7K325T-2FFV900I ECAD Model


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XC7K325T-2FFV900I Attributes


Type Description Select
Mfr AMD Xilinx
Series Kintex®-7
Package Tray
Number of LABs/CLBs 25475
Number of Logic Elements/Cells 326080
Total RAM Bits 16404480
Number of I/O 500
Voltage - Supply 0.97V ~ 1.03V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)

XC7K325T-2FFV900I Overview



The XC7K325T-2FFV900I is a high-performance, low-power integrated circuit manufactured by Xilinx. It is a Kintex-7 FPGA (Field Programmable Gate Array) device and features a combination of high-speed transceivers, high-speed I/O and a high-performance, low-power Kintex-7 FPGA fabric. It is ideal for applications in the areas of data center, networking, video, and general-purpose FPGA designs.


The XC7K325T-2FFV900I has a total of 325,280 logic cells and a total of 1,496,640 flip-flops. It has 1,536 DSP slices and a total of 3,072 block RAMs. It also features a total of 900 user I/O pins and 8 high-speed transceivers. The device is capable of operating at a maximum frequency of 600MHz and has a maximum power dissipation of 19.6W.


The XC7K325T-2FFV900I is an ideal choice for applications in the areas of data center, networking, video, and general-purpose FPGA designs. It can be used for a wide range of applications such as machine learning, 5G wireless communication, video processing, and data center acceleration. It can also be used for applications such as high-speed networking, high-speed data transfer, and high-speed signal processing. The XC7K325T-2FFV900I is a high-performance, low-power integrated circuit that is ideal for a variety of applications.



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