XC95144XV-5CS144C
XC95144XV-5CS144C ECAD Model
XC95144XV-5CS144C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 5 ns | |
| Number of Macro Cells | 144 | |
| Number of I/O Lines | 117 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 117 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 222.2 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.8/3.3,2.5 V | |
| Supply Voltage-Max | 2.62 V | |
| Supply Voltage-Min | 2.37 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC95144XV-5CS144C Datasheet Download
XC95144XV-5CS144C Overview
The XC95144XV-5CS144C chip model is a high-performance, low-cost, low-power CPLD (Complex Programmable Logic Device) designed by Xilinx. It is designed to provide superior performance, flexibility, and scalability for a wide range of applications. The chip model is widely used in the field of communication systems, making it an ideal choice for advanced communication systems.
The XC95144XV-5CS144C chip model is capable of providing a wide range of features, including high-speed data transfer, flexible programming, and low power consumption. It is also capable of supporting multiple standards, including Ethernet, Wi-Fi, and other wireless protocols. This makes it an ideal choice for applications in networks that require high-speed data transfer, such as cloud computing, video streaming, and other advanced applications.
The XC95144XV-5CS144C chip model is also capable of being used in intelligent scenarios. It can be used in the development of intelligent robots and other intelligent applications. It is also capable of being used in the development of fully intelligent systems. This chip model is capable of providing the necessary support for the development and popularization of future intelligent robots.
In order to use the XC95144XV-5CS144C chip model effectively, it is important to have the necessary technical talents. This includes knowledge of computer programming, software engineering, and electronic engineering. It is also important to have a good understanding of the chip model, its features, and its capabilities. With the right technical skills, the XC95144XV-5CS144C chip model can be used to its full potential.
The XC95144XV-5CS144C chip model is a versatile and powerful chip model that can be used in a variety of applications. It is capable of providing high-speed data transfer, flexible programming, and low power consumption, making it an ideal choice for advanced communication systems. It is also capable of being used in intelligent scenarios and the development of fully intelligent systems. With the right technical skills, the XC95144XV-5CS144C chip model can be used to its full potential, making it an ideal choice for the development and popularization of future intelligent robots.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||