XC95144XV-7CS144C
XC95144XV-7CS144C ECAD Model
XC95144XV-7CS144C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 7.5 ns | |
| Number of Macro Cells | 144 | |
| Number of I/O Lines | 117 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 117 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 125 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.8/3.3,2.5 V | |
| Supply Voltage-Max | 2.62 V | |
| Supply Voltage-Min | 2.37 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC95144XV-7CS144C Datasheet Download
XC95144XV-7CS144C Overview
The XC95144XV-7CS144C chip model is a versatile integrated circuit that is designed to meet the needs of the modern world. It is a powerful and cost-effective solution for a variety of applications, and its features make it an ideal choice for many industries.
The XC95144XV-7CS144C chip model offers a number of advantages over other chip models. It is capable of high-speed data processing, making it suitable for use in network applications. It is also highly reliable, with a low power consumption rate, making it an ideal choice for many applications. Furthermore, it is compatible with many existing systems, making it easy to integrate with existing networks.
The XC95144XV-7CS144C chip model is expected to see increasing demand in the coming years, as the need for more powerful and reliable solutions grows. In particular, the chip model is expected to be used increasingly in network applications, as the need for faster, more reliable data processing increases. Additionally, the chip model is expected to be used in a variety of intelligent scenarios, such as autonomous vehicles, intelligent home systems, and other applications.
The XC95144XV-7CS144C chip model is also expected to be used in the development and popularization of future intelligent robots. The chip model's features make it an ideal choice for robotic applications, as it is capable of high-speed data processing, is highly reliable, and is compatible with existing systems. In order to effectively use the chip model for robotics applications, technical expertise is required in order to program the chip model correctly.
In conclusion, the XC95144XV-7CS144C chip model is a powerful and cost-effective solution for a variety of applications. It is expected to be used increasingly in network applications, as well as in a variety of intelligent scenarios. Additionally, it is expected to be used in the development and popularization of future intelligent robots. In order to use the chip model effectively, technical expertise is required.
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