XCAU15P-L1FFVB676I

The XCAU15P-L1FFVB676I chip model is an integrated circuit (IC) developed by Xilinx Inc. It is a field programmable gate array (FPGA) device that can be used to create custom logic circuits and systems. It is based on a Xilinx Virtex UltraScale+ FPGA architecture and is suitable for a wide variety of applications, including aerospace, automotive, industrial, medical, and military.

The device is packaged in a 17 x 17 mm, 676-pin flip-chip BGA package and includes up to 1.5 million logic cells, up to 8.2 million system gates, up to 8.2 million flip-flops, and up to 8.2 million RAM bits. It also features up to 896 DSP slices, up to 4,000 I/O pins, and up to 6.4 Gbps transceivers. It has an operating temperature range of -40 to +85 degrees Celsius, a maximum core voltage of 1.2V, and a maximum I/O voltage of 2.5V.

The XCAU15P-L1FFVB676I is suitable for a wide range of applications, such as high-speed networking, data center acceleration, machine learning, video and image processing, and embedded systems. It can also be used for signal processing, digital signal processing, and high-speed digital design. Additionally, it is suitable for applications that require high-speed data transfer and low-power operation.