XCR3320-10BG256C
XCR3320-10BG256C
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rohs
Xilinx

XCR3320-10BG256C


XCR3320-10BG256C
F20-XCR3320-10BG256C
Active
LOADABLE PLD, 10 ns, 320-Cell, CMOS, PLASTIC, BGA-256
PLASTIC, BGA-256

XCR3320-10BG256C ECAD Model


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XCR3320-10BG256C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Propagation Delay 10 ns
Number of Dedicated Inputs 12
Number of Macro Cells 320
Number of I/O Lines 3
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 12 DEDICATED INPUTS, 3 I/O
Additional Feature YES
Clock Frequency-Max 87 MHz
In-System Programmable YES
JTAG BST YES
Output Function MACROCELL
Power Supplies 3.3 V
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,20X20,50
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.55 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description PLASTIC, BGA-256
Pin Count 256
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XCR3320-10BG256C Datasheet Download


XCR3320-10BG256C Overview


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