XCR3384XL-7FG324C
XCR3384XL-7FG324C
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rohs
Xilinx

XCR3384XL-7FG324C


XCR3384XL-7FG324C
F20-XCR3384XL-7FG324C
Active
EE PLD, 7.5 ns, 384-Cell, CMOS, FBGA-324
FBGA-324

XCR3384XL-7FG324C ECAD Model


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XCR3384XL-7FG324C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Propagation Delay 7.5 ns
Number of Macro Cells 384
Number of I/O Lines 220
Programmable Logic Type EE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 0 DEDICATED INPUTS, 220 I/O
Additional Feature YES
Clock Frequency-Max 135 MHz
In-System Programmable YES
JTAG BST YES
Output Function MACROCELL
Power Supplies 3.3 V
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B324
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 324
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA324,20X20,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-324
Pin Count 324
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XCR3384XL-7FG324C Datasheet Download


XCR3384XL-7FG324C Overview



The chip model XCR3384XL-7FG324C is a cutting-edge model designed for modern communication systems. It has a wide range of applications and is considered to be one of the most advanced chips on the market. In particular, it is designed to be used in advanced communication systems, such as 5G networks and beyond.


The XCR3384XL-7FG324C chip model offers a number of advantages over its predecessors. It is capable of supporting a wide range of communication protocols, including Advanced Mobile Network Protocols (AMNP), which are essential for the development of 5G networks. In addition, it is capable of providing high-speed data transmission and is equipped with an advanced security system. This makes it ideal for use in a variety of communication systems, from small-scale networks to large-scale infrastructure.


The chip model is also designed to be able to be upgraded in the future. This means that it can be used in the most advanced communication systems, such as the upcoming 6G networks. In addition, its design allows for the possibility of further upgrades, such as the integration of artificial intelligence (AI) and machine learning (ML) technologies. This would enable the XCR3384XL-7FG324C chip model to be used in a variety of intelligent scenarios, such as autonomous driving, smart homes, and smart cities.


The XCR3384XL-7FG324C chip model is expected to be in high demand in the future, as more and more communication systems are being developed and deployed. As such, it is likely to be used in a variety of applications, from small-scale networks to large-scale infrastructure. In addition, its potential to be used in the era of fully intelligent systems makes it an ideal candidate for use in a variety of intelligent scenarios.


Overall, the XCR3384XL-7FG324C chip model is a cutting-edge model designed for modern communication systems. It is capable of supporting a wide range of communication protocols, providing high-speed data transmission, and is equipped with an advanced security system. It is also designed to be able to be upgraded in the future, making it ideal for use in a variety of intelligent scenarios. As such, it is expected to be in high demand in the future, and is likely to be used in a variety of applications, from small-scale networks to large-scale infrastructure.



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