XCS30XL-3PQG240C
XCS30XL-3PQG240C
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rohs
Xilinx

XCS30XL-3PQG240C


XCS30XL-3PQG240C
F20-XCS30XL-3PQG240C
Active
FIELD PROGRAMMABLE GATE ARRAY, FQFP
FQFP

XCS30XL-3PQG240C ECAD Model


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XCS30XL-3PQG240C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Equivalent Gates 10000
Number of CLBs 576
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 576 CLBS, 10000 GATES
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PQFP-G240
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 240
Package Body Material PLASTIC/EPOXY
Package Code FQFP
Package Shape SQUARE
Package Style FLATPACK, FINE PITCH
Surface Mount YES
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 32 mm
Length 32 mm
Seated Height-Max 4.1 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description FQFP,
Pin Count 240
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCS30XL-3PQG240C Datasheet Download


XCS30XL-3PQG240C Overview



The XCS30XL-3PQG240C chip model is a state-of-the-art integrated circuit developed by Xilinx, Inc. It is a field-programmable gate array (FPGA) device that combines the power of a microprocessor and the flexibility of a programmable logic device. This chip model is designed to meet the requirements of high-speed and low-power applications, such as those found in automotive, industrial, and communications systems.


The XCS30XL-3PQG240C chip model has several advantages over traditional FPGAs. It is designed to be highly efficient, consuming up to 50 percent less power than other FPGAs. It also features an advanced architecture that provides high-speed performance and low-latency response times. The chip also has a low-cost, low-power, and low-noise design that makes it ideal for use in high-end applications.


In terms of future demand trends, the XCS30XL-3PQG240C chip model is expected to be increasingly used in automotive, industrial, and communications systems. This is due to its low power consumption and its ability to handle high-speed operations and low-latency response times. Furthermore, its low cost makes it an attractive option for system designers.


The original design intention of the XCS30XL-3PQG240C chip model was to provide a high-performance, low-power, and low-cost solution for high-end applications. It was also designed to be highly scalable, allowing for future upgrades and modifications. This chip model is also capable of being used in advanced communication systems, as it has the necessary features to support such applications.


The specific design requirements of the XCS30XL-3PQG240C chip model include a low-power, low-noise, and low-cost design. It also features advanced architecture that provides high-speed performance and low-latency response times. Additionally, it is capable of handling large amounts of data, while also providing a secure and reliable platform for applications.


There are many case studies that demonstrate the effectiveness of the XCS30XL-3PQG240C chip model. For example, it has been used in a variety of automotive, industrial, and communication systems. It has also been used in a variety of applications, such as image processing, data storage, and wireless communication.


When using the XCS30XL-3PQG240C chip model, it is important to keep in mind that it is a highly advanced and complex device. Therefore, it is important to have a thorough understanding of its features and capabilities before attempting to use it. Additionally, it is important to ensure that the chip is properly integrated into the system, as any errors or incompatibilities could lead to unexpected results.



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