XCS30XL-3PQG240C
XCS30XL-3PQG240C ECAD Model
XCS30XL-3PQG240C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Equivalent Gates | 10000 | |
Number of CLBs | 576 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 576 CLBS, 10000 GATES | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PQFP-G240 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 240 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 32 mm | |
Length | 32 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | FQFP, | |
Pin Count | 240 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCS30XL-3PQG240C Datasheet Download
XCS30XL-3PQG240C Overview
The XCS30XL-3PQG240C chip model is a state-of-the-art integrated circuit developed by Xilinx, Inc. It is a field-programmable gate array (FPGA) device that combines the power of a microprocessor and the flexibility of a programmable logic device. This chip model is designed to meet the requirements of high-speed and low-power applications, such as those found in automotive, industrial, and communications systems.
The XCS30XL-3PQG240C chip model has several advantages over traditional FPGAs. It is designed to be highly efficient, consuming up to 50 percent less power than other FPGAs. It also features an advanced architecture that provides high-speed performance and low-latency response times. The chip also has a low-cost, low-power, and low-noise design that makes it ideal for use in high-end applications.
In terms of future demand trends, the XCS30XL-3PQG240C chip model is expected to be increasingly used in automotive, industrial, and communications systems. This is due to its low power consumption and its ability to handle high-speed operations and low-latency response times. Furthermore, its low cost makes it an attractive option for system designers.
The original design intention of the XCS30XL-3PQG240C chip model was to provide a high-performance, low-power, and low-cost solution for high-end applications. It was also designed to be highly scalable, allowing for future upgrades and modifications. This chip model is also capable of being used in advanced communication systems, as it has the necessary features to support such applications.
The specific design requirements of the XCS30XL-3PQG240C chip model include a low-power, low-noise, and low-cost design. It also features advanced architecture that provides high-speed performance and low-latency response times. Additionally, it is capable of handling large amounts of data, while also providing a secure and reliable platform for applications.
There are many case studies that demonstrate the effectiveness of the XCS30XL-3PQG240C chip model. For example, it has been used in a variety of automotive, industrial, and communication systems. It has also been used in a variety of applications, such as image processing, data storage, and wireless communication.
When using the XCS30XL-3PQG240C chip model, it is important to keep in mind that it is a highly advanced and complex device. Therefore, it is important to have a thorough understanding of its features and capabilities before attempting to use it. Additionally, it is important to ensure that the chip is properly integrated into the system, as any errors or incompatibilities could lead to unexpected results.
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