XCS30XL-3VQ100I
XCS30XL-3VQ100I
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rohs
Xilinx

XCS30XL-3VQ100I


XCS30XL-3VQ100I
F20-XCS30XL-3VQ100I
Active
FIELD PROGRAMMABLE GATE ARRAY, PLASTIC, VQFP-100
PLASTIC, VQFP-100

XCS30XL-3VQ100I ECAD Model


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XCS30XL-3VQ100I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Equivalent Gates 10000
Number of CLBs 576
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Organization 576 CLBS, 10000 GATES
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PQFP-G100
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of Terminals 100
Package Body Material PLASTIC/EPOXY
Package Code TFQFP
Package Shape SQUARE
Package Style FLATPACK, THIN PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 14 mm
Length 14 mm
Seated Height-Max 1.2 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description PLASTIC, VQFP-100
Pin Count 100
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCS30XL-3VQ100I Datasheet Download


XCS30XL-3VQ100I Overview



The chip model XCS30XL-3VQ100I is a cutting-edge semiconductor product that has revolutionized the industry. Developed by Xilinx, a leading provider of programmable logic devices, the XCS30XL-3VQ100I is an advanced FPGA (Field Programmable Gate Array) that offers unprecedented performance and flexibility. It is designed to provide a highly efficient, low-cost solution for complex data processing and control applications.


The XCS30XL-3VQ100I is a powerful and versatile chip model that offers a wide range of features and capabilities. It is capable of supporting a variety of data processing tasks, including high-speed memory access, data processing, and communication. It also supports a range of advanced features, such as dynamic reconfiguration, clock synchronization, and on-chip debugging. The chip model also provides excellent power efficiency, making it suitable for applications in a variety of power-sensitive environments.


In terms of industry trends, the XCS30XL-3VQ100I is expected to remain a popular chip model in the future. It is likely to be used in a variety of industries, including communications, automotive, industrial, and consumer electronics. As the demand for more efficient and cost-effective solutions continues to grow, the XCS30XL-3VQ100I is expected to remain an attractive option for businesses.


The XCS30XL-3VQ100I is also likely to be used in a variety of networks, including 5G, IoT, and AI. It is expected to be used in a variety of intelligent scenarios, such as autonomous driving, smart homes, and smart cities. It is also likely to be used in the era of fully intelligent systems, such as the Internet of Things (IoT), where it can be used to enable the development of intelligent applications.


In terms of future development, the XCS30XL-3VQ100I is likely to require the support of new technologies in order to meet the ever-evolving requirements of its application environment. These technologies may include advanced algorithms, artificial intelligence, and machine learning. As the demand for more powerful and efficient solutions increases, so too will the need for the XCS30XL-3VQ100I to be supported by new technologies.


In conclusion, the XCS30XL-3VQ100I is a cutting-edge chip model that offers a wide range of features and capabilities. It is expected to remain a popular choice in the future, with its use likely to extend to a variety of industries and networks. It is also expected to be used in the era of fully intelligent systems, which will require the support of new technologies in order to meet the ever-evolving requirements of its application environment.



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