XCS40-3BGG256C
XCS40-3BGG256C ECAD Model
XCS40-3BGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 13000 | |
| Number of CLBs | 784 | |
| Combinatorial Delay of a CLB-Max | 1.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 784 CLBS, 13000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES 40000 | |
| Clock Frequency-Max | 125 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCS40-3BGG256C Datasheet Download
XCS40-3BGG256C Overview
The XCS40-3BGG256C chip model is an innovative product from the semiconductor industry, developed with the intention of providing a reliable, cost-effective solution for a wide range of applications. The model is designed to provide superior performance, with a low power consumption and a high level of integration. It is capable of supporting high-speed data transfers, as well as a wide range of communication protocols.
The XCS40-3BGG256C chip model is expected to become increasingly popular in the near future, due to its advantages over other models on the market. These advantages include its low power consumption, high level of integration, and its ability to support a wide range of communication protocols. In addition, the chip model is also capable of supporting advanced communication systems, making it an ideal choice for businesses that require a reliable and cost-effective solution.
The XCS40-3BGG256C chip model is also capable of being upgraded in the future, allowing businesses to take advantage of new features and technologies as they become available. This makes the chip model an ideal choice for businesses that need to stay ahead of the curve in terms of technology. It is also possible for the chip model to be used in a variety of networks, including wireless and wired networks, as well as in intelligent scenarios.
The XCS40-3BGG256C chip model is also likely to be an important part of future intelligent systems, as it is capable of supporting a wide range of communication protocols and advanced communication systems. This makes it an ideal choice for businesses that want to stay ahead of the curve in terms of technology and be prepared for the future. The chip model is also likely to be used in the era of fully intelligent systems, allowing businesses to take advantage of the latest advancements in technology.
Overall, the XCS40-3BGG256C chip model is an innovative product from the semiconductor industry, designed with the intention of providing a reliable, cost-effective solution for a wide range of applications. It is expected to become increasingly popular in the near future, due to its advantages over other models on the market, as well as its ability to be upgraded in the future. The chip model is also capable of being used in a variety of networks, including wireless and wired networks, as well as in intelligent scenarios. Finally, the chip model is likely to be an important part of future intelligent systems, allowing businesses to take advantage of the latest advancements in technology.
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Pricing (USD)
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|---|---|---|
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