XCS40XL-3PQG240I
XCS40XL-3PQG240I
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rohs
Xilinx

XCS40XL-3PQG240I


XCS40XL-3PQG240I
F20-XCS40XL-3PQG240I
Active
FIELD PROGRAMMABLE GATE ARRAY, FQFP
FQFP

XCS40XL-3PQG240I ECAD Model


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XCS40XL-3PQG240I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Equivalent Gates 13000
Number of CLBs 784
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Organization 784 CLBS, 13000 GATES
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PQFP-G240
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 3
Number of Terminals 240
Package Body Material PLASTIC/EPOXY
Package Code FQFP
Package Shape SQUARE
Package Style FLATPACK, FINE PITCH
Surface Mount YES
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 32 mm
Length 32 mm
Seated Height-Max 4.1 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description FQFP,
Pin Count 240
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCS40XL-3PQG240I Datasheet Download


XCS40XL-3PQG240I Overview



The XCS40XL-3PQG240I chip model is a high-performance, low-power, reconfigurable FPGA device designed for digital signal processing, embedded processing, and image processing applications. The device is built on the Xilinx Spartan-6 FPGA architecture and is capable of delivering up to 3.2Gbps of bandwidth. The device is programmed using the HDL language, and it is designed to reduce the power consumption of the system while providing superior performance.


The XCS40XL-3PQG240I chip model offers a wide range of advantages to its users, including high performance, low power consumption, and flexibility. The device is capable of handling complex and intensive tasks, such as image processing, with ease. Additionally, the device can be reconfigured quickly to adapt to changing requirements and conditions. The device also provides an easy-to-use design interface, allowing users to quickly and easily create custom designs.


The demand for the XCS40XL-3PQG240I chip model is expected to grow in the coming years, as more and more applications require high-performance, low-power, and reconfigurable FPGA devices. The device is already being used in a variety of industries, including automotive, aerospace, industrial automation, and consumer electronics. As these industries continue to grow, the demand for the XCS40XL-3PQG240I chip model is expected to increase.


When designing with the XCS40XL-3PQG240I chip model, it is important to consider the specific design requirements of the application. The device is capable of handling a wide range of tasks, but it is important to ensure that the design meets the specific requirements of the application. Additionally, it is important to consider the power and performance requirements of the application, as the device is designed to deliver superior performance while reducing power consumption.


The XCS40XL-3PQG240I chip model can be used in a variety of applications, and there are many case studies available to demonstrate its effectiveness. Additionally, it is important to consider the potential risks associated with the device, such as overheating, power surges, and EMI interference. By taking these precautions into account, users can ensure that their designs are reliable and effective.



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