XCS40XL-5BGG256C
XCS40XL-5BGG256C
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rohs
Xilinx

XCS40XL-5BGG256C


XCS40XL-5BGG256C
F20-XCS40XL-5BGG256C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PLASTIC, BGA-256
PLASTIC, BGA-256

XCS40XL-5BGG256C ECAD Model


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XCS40XL-5BGG256C Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Inputs 205
Number of Outputs 205
Number of Logic Cells 1862
Number of Equivalent Gates 13000
Number of CLBs 784
Combinatorial Delay of a CLB-Max 1 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 784 CLBS, 13000 GATES
Additional Feature MAXIMUM USABLE GATES 40000
Clock Frequency-Max 250 MHz
Power Supplies 3.3 V
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,20X20,50
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.55 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description PLASTIC, BGA-256
Pin Count 256
Reach Compliance Code unknown
HTS Code 8542.39.00.01

XCS40XL-5BGG256C Datasheet Download


XCS40XL-5BGG256C Overview



The XCS40XL-5BGG256C chip model is an advanced, high-end product in the semiconductor industry. It is designed to meet the needs of various applications and industries. It has a wide range of features, such as high speed, low power consumption, and high reliability. It is suitable for many applications, such as automotive, industrial, and consumer electronics.


The XCS40XL-5BGG256C chip model is built on the latest technology, providing the highest performance and reliability. It is designed to be compatible with a wide range of applications, such as automotive, industrial, and consumer electronics. The chip model is also designed to be scalable, allowing for future upgrades and enhancements. It is suitable for a wide range of applications, including advanced communication systems.


The XCS40XL-5BGG256C chip model is expected to be in high demand in the future, as it is a highly advanced product with a wide range of features and benefits. It is suitable for a wide range of applications, including automotive, industrial, and consumer electronics. It is also expected to be in high demand for advanced communication systems, as it is designed to be compatible with a wide range of technologies.


In terms of industry trends, the XCS40XL-5BGG256C chip model is expected to remain in high demand in the future. It is designed to be compatible with a wide range of applications and technologies, allowing it to be used in a wide range of industries. It is also expected to be in high demand for advanced communication systems, as it is designed to be compatible with a wide range of technologies.


In terms of the application environment, the XCS40XL-5BGG256C chip model is designed to be compatible with a wide range of technologies. It is also designed to be scalable, allowing for future upgrades and enhancements. As such, it is suitable for a wide range of applications, including advanced communication systems.


In summary, the XCS40XL-5BGG256C chip model is an advanced, high-end product in the semiconductor industry. It is designed to be compatible with a wide range of applications and technologies, allowing it to be used in a wide range of industries. It is expected to remain in high demand in the future, as it is designed to be scalable, allowing for future upgrades and enhancements. It is suitable for a wide range of applications, including advanced communication systems.



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