XCV1000E-8FGG900I
XCV1000E-8FGG900I ECAD Model
XCV1000E-8FGG900I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 331776 | |
| Number of CLBs | 6144 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 331776 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA900,30X30,40 | |
| Pin Count | 900 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV1000E-8FGG900I Datasheet Download
XCV1000E-8FGG900I Overview
The XCV1000E-8FGG900I chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is designed to be used with HDL languages, making it a great choice for applications that require high performance and accuracy.
The industry trends of the XCV1000E-8FGG900I chip model and the future development of related industries will depend on the specific technologies that are needed. New technologies such as artificial intelligence, machine learning, and robotics will be required to take advantage of the chip's capabilities.
The XCV1000E-8FGG900I chip model can be applied to the development and popularization of future intelligent robots. To use the model effectively, technical talents with knowledge and experience in HDL languages, artificial intelligence, machine learning, and robotics will be required. This will help ensure that the chip model is used to its fullest potential and that intelligent robots are developed to their highest potential.
Overall, the XCV1000E-8FGG900I chip model is a powerful and versatile tool that can be used for a variety of applications. With the right technical talents, the chip model can be used to develop and popularize future intelligent robots. With the right technologies, the chip model can be used to its fullest potential and help drive the development of related industries.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||