XCV150-5BGG352C
XCV150-5BGG352C
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rohs
Xilinx

XCV150-5BGG352C


XCV150-5BGG352C
F20-XCV150-5BGG352C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LBGA
LBGA

XCV150-5BGG352C ECAD Model


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XCV150-5BGG352C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 164674
Number of CLBs 864
Combinatorial Delay of a CLB-Max 700 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 864 CLBS, 164674 GATES
Clock Frequency-Max 294 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B352
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 352
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LBGA,
Pin Count 352
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV150-5BGG352C Datasheet Download


XCV150-5BGG352C Overview



The XCV150-5BGG352C chip model is a high-performance, low-power digital signal processor that is designed for embedded and image processing applications. It is a versatile, high-performance and cost-effective solution for a wide range of applications, such as digital signal processing, embedded processing, and image processing. The XCV150-5BGG352C chip model is based on a high-performance, low-power HDL (Hardware Description Language) architecture, making it ideal for embedded and image processing applications.


The XCV150-5BGG352C chip model has many advantages over other chip models. It is a cost-effective solution that offers high speed, low power consumption, and high-quality performance. It is also highly reliable and has a long life-span. Additionally, it is easy to program and is compatible with a wide range of platforms, making it an ideal choice for many applications.


The demand for the XCV150-5BGG352C chip model is expected to continue to grow in the future due to its versatility, high-performance, and cost-effectiveness. It is a reliable and cost-effective solution for a wide range of applications, and its versatility makes it suitable for many different types of applications. Additionally, its low power consumption and high-quality performance make it an ideal choice for embedded and image processing applications.


The original design intention of the XCV150-5BGG352C chip model was to provide a cost-effective solution for a wide range of applications. It was designed to be highly reliable, low power, and high-performance, making it an ideal choice for many applications. Additionally, the XCV150-5BGG352C chip model is highly upgradable and can be used for advanced communication systems. The chip model is also designed to be compatible with a wide range of platforms, making it an ideal choice for many applications.


The XCV150-5BGG352C chip model is a versatile, high-performance, and cost-effective solution for a wide range of applications. Its high-performance and low-power HDL architecture make it an ideal choice for embedded and image processing applications. Additionally, its upgradability makes it suitable for advanced communication systems. It is a reliable and cost-effective solution for a wide range of applications, and its versatility makes it suitable for many different types of applications. The XCV150-5BGG352C chip model is expected to continue to be in high demand in the future due to its versatility, high-performance, and cost-effectiveness.



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