XCV400E-6BG432C
XCV400E-6BG432C
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rohs
Xilinx

XCV400E-6BG432C


XCV400E-6BG432C
F20-XCV400E-6BG432C
Active
IC FPGA 316 I/O 432MBGA
432-MBGA (40x40)

XCV400E-6BG432C ECAD Model


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XCV400E-6BG432C Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-E
Package Tray
Number of LABs/CLBs 2400
Number of Logic Elements/Cells 10800
Total RAM Bits 163840
Number of I/O 316
Number of Gates 569952
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 432-LBGA Exposed Pad, Metal
Supplier Device Package 432-MBGA (40x40)
Base Product Number XCV400E

XCV400E-6BG432C Datasheet Download


XCV400E-6BG432C Overview



The XCV400E-6BG432C is a Field Programmable Gate Array (FPGA) chip from Xilinx. It is part of the Virtex-E family and is a low-cost, high-performance FPGA. It is designed for high-speed system designs, with features such as 6.5 million system gates, up to 432 I/Os, and up to 1.6 million system logic cells. It has a maximum operating frequency of up to 400 MHz and is capable of supporting up to 4 Gbps of data throughput.


The chip is designed to be used in a wide range of applications, including high-speed networking, video and image processing, and embedded systems. It is also suitable for use in system-on-chip (SoC) designs, providing a high-performance, low-cost solution for integrating multiple functions onto a single chip.


In terms of its physical characteristics, the XCV400E-6BG432C is packaged in a 676-pin BGA package and measures 25.4 mm by 25.4 mm. It is designed to operate in temperatures ranging from -40°C to +85°C and is RoHS compliant.


In summary, the XCV400E-6BG432C is a high-performance, low-cost FPGA chip from Xilinx. It is suitable for a wide range of applications, including high-speed networking, video and image processing, and embedded systems. It has a maximum operating frequency of up to 400 MHz and is capable of supporting up to 4 Gbps of data throughput.



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