XCV400E-6BG432I
XCV400E-6BG432I ECAD Model
XCV400E-6BG432I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 316 | |
| Number of Outputs | 316 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 129600 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 129600 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV400E-6BG432I Datasheet Download
XCV400E-6BG432I Overview
The chip model XCV400E-6BG432I is a high-performance, low-power, cost-effective chip designed for embedded system applications. It is based on the latest technology, with features such as a high frequency, low power consumption, and a wide range of operating temperatures. This chip model is ideal for a wide range of applications, from automotive to industrial, and can be used in many different scenarios.
In terms of industry trends, the chip model XCV400E-6BG432I is expected to be increasingly used in the embedded system market. As the demand for embedded systems grows, this chip model will be increasingly used in various applications such as automotive, industrial, and consumer electronics. The chip model is expected to be widely used in industries such as automotive, industrial, and consumer electronics.
The chip model XCV400E-6BG432I is also expected to be used in networks and intelligent scenarios. With its high frequency and low power consumption, the chip model is suitable for use in networks and intelligent systems. As the demand for intelligent systems grows, this chip model is expected to be increasingly used in networks and intelligent scenarios.
In addition, the chip model XCV400E-6BG432I is expected to be used in the era of fully intelligent systems. With its high frequency and low power consumption, the chip model is suitable for use in fully intelligent systems. As the demand for intelligent systems grows, this chip model is expected to be increasingly used in fully intelligent systems.
Overall, the chip model XCV400E-6BG432I is a high-performance, low-power, cost-effective chip designed for embedded system applications. It is expected to be increasingly used in the embedded system market, as well as in networks and intelligent scenarios. Moreover, the chip model is expected to be used in the era of fully intelligent systems. Therefore, the chip model XCV400E-6BG432I is a promising chip model for future applications.
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