XCV400E-6BGG432C
XCV400E-6BGG432C ECAD Model
XCV400E-6BGG432C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 316 | |
| Number of Outputs | 316 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 129600 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 129600 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV400E-6BGG432C Datasheet Download
XCV400E-6BGG432C Overview
The chip model XCV400E-6BGG432C is a cutting-edge technology in the chip manufacturing industry. It is a high-performance, low-power, and low-cost solution for many applications. It has a wide range of features and capabilities that make it suitable for a variety of applications.
The XCV400E-6BGG432C is designed to meet the demands of the modern world. It is capable of handling a wide range of tasks, from basic computing to complex machine learning algorithms. It has a high clock frequency, allowing for rapid execution of instructions, and a low power consumption, making it suitable for small, portable devices. It also has a small form factor, making it suitable for a variety of applications.
The XCV400E-6BGG432C is a versatile chip that can be used in a variety of industries, from automotive to robotics. It is capable of supporting the development of intelligent robots, as it has the ability to process large amounts of data quickly and accurately. It can also be used in the medical industry, as it has the capability to process medical images quickly and accurately.
In order to use the XCV400E-6BGG432C effectively, it is important to understand the industry trends and future development of related industries. As the chip model is constantly evolving, it is important to stay up to date with the latest advancements in technology. It is also important to understand the specific design requirements of the chip model, as well as any actual case studies and precautions.
When it comes to the application of the XCV400E-6BGG432C in the development and popularization of future intelligent robots, it is important to understand the technical talents that are needed. This includes knowledge of machine learning algorithms, artificial intelligence, and robotics. In order to effectively use the chip model, it is important to have a strong understanding of the underlying technologies.
In conclusion, the XCV400E-6BGG432C is a cutting-edge chip model that is capable of handling a wide range of tasks. It is important to stay up to date with the industry trends and future development of related industries in order to use the chip model effectively. It is also important to understand the specific design requirements of the chip model, as well as any actual case studies and precautions. Furthermore, it is important to understand the technical talents that are needed in order to effectively use the chip model in the development and popularization of future intelligent robots.
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|---|---|---|
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