XCV400E-6BGG432I
XCV400E-6BGG432I ECAD Model
XCV400E-6BGG432I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 316 | |
| Number of Outputs | 316 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 129600 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 129600 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV400E-6BGG432I Datasheet Download
XCV400E-6BGG432I Overview
The chip model XCV400E-6BGG432I is a powerful digital signal processing chip that has been developed by a leading semiconductor manufacturer. It is designed to meet the needs of high-performance embedded processing and image processing. This chip is well-suited for use in a variety of applications, including digital signal processing, embedded processing, and image processing. The chip model XCV400E-6BGG432I is designed to be programmed in HDL language, allowing for a more efficient development process and greater flexibility in terms of implementation.
The XCV400E-6BGG432I chip has a number of advantages that make it an attractive option for a variety of applications. It is capable of handling complex calculations quickly and accurately, and its high-speed operation allows for faster processing of data. It is also designed to be power-efficient, making it ideal for applications that require low power consumption. In addition, the chip model XCV400E-6BGG432I is highly reliable, making it suitable for use in mission-critical applications.
The demand for chip model XCV400E-6BGG432I is expected to remain strong in the future, as the demand for high-performance embedded and image processing continues to grow. The chip model is also well-suited for use in a variety of industries, including automotive, aerospace, industrial automation, and consumer electronics. In addition, the chip model is expected to be used in more advanced communication systems in the future, as the technology continues to evolve.
The original design intention of the chip model XCV400E-6BGG432I was to provide high-performance embedded and image processing capabilities, while maintaining low power consumption. The chip model was designed with a modular architecture, allowing for easy upgrades and modifications in the future. The chip model is also designed to be compatible with a variety of communication protocols and standards, making it suitable for use in advanced communication systems.
In conclusion, the chip model XCV400E-6BGG432I is a powerful digital signal processing chip that is well-suited for a variety of applications. It is designed to be power-efficient, reliable, and compatible with a variety of communication protocols and standards. The chip model is expected to remain in high demand in the future, and is capable of being upgraded and modified to meet the needs of more advanced communication systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||