XCV400E-6BGG560I
XCV400E-6BGG560I ECAD Model
XCV400E-6BGG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 129600 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 129600 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCV400E-6BGG560I Datasheet Download
XCV400E-6BGG560I Overview
The XCV400E-6BGG560I chip model is a highly advanced and efficient device for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with a hardware description language (HDL). This chip model is a great choice for any application that requires a powerful and reliable processor.
The XCV400E-6BGG560I chip model is at the cutting edge of technology and is designed to meet the needs of the most demanding applications. It offers high-performance computing capabilities and is ideal for applications that require multiple processing cores and high memory bandwidth. The chip model also has an integrated power management unit, allowing for efficient power management and improved system performance.
In terms of industry trends, the XCV400E-6BGG560I chip model is likely to remain popular in the coming years due to its high-performance capabilities and its ability to meet the needs of a wide range of applications. It is likely that the chip model will continue to be used in many applications, from digital signal processing to embedded processing and image processing.
When it comes to the product description and specific design requirements of the XCV400E-6BGG560I chip model, it is important to ensure that the design meets the specific requirements of the application. This includes the type of processing cores and memory bandwidth that are needed, as well as any specific power management requirements. Additionally, there are a number of precautions that should be taken when using the chip model, such as ensuring that the power supply is adequate and that the chip is not over-clocked.
Finally, when considering the application environment of the XCV400E-6BGG560I chip model, it is important to consider whether any new technologies are needed to support the application. This could include anything from new software or hardware to new communication protocols or other technologies. In any case, it is important to ensure that the chip model is compatible with the application and that any new technologies are properly integrated.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||