XCV400E-7BGG560C
XCV400E-7BGG560C ECAD Model
XCV400E-7BGG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 129600 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 129600 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV400E-7BGG560C Datasheet Download
XCV400E-7BGG560C Overview
The XCV400E-7BGG560C chip model is a cutting-edge technology developed by a leading semiconductor manufacturer. It offers a wide range of features, including high-speed operation, low power consumption, and high integration. These features make the XCV400E-7BGG560C the ideal choice for a variety of applications in the semiconductor industry.
The XCV400E-7BGG560C chip model is designed to meet the demands of the rapidly growing semiconductor industry. It is capable of performing a variety of tasks, including high-speed data processing, low-power operation, and high-level integration. It is also suitable for a wide range of applications, including automotive, consumer electronics, medical, and industrial.
The XCV400E-7BGG560C chip model is an excellent choice for those looking to develop and popularize the next generation of intelligent robots. It is capable of performing complex tasks and is highly integrated, making it ideal for robotic applications. Additionally, its low power consumption and high-speed operation make it a great choice for those looking to increase the efficiency of their robotic designs.
In order to effectively use the XCV400E-7BGG560C chip model, a number of technical skills are required. These include an understanding of the chip's architecture, the ability to write and debug code, and the ability to use the chip's features in a variety of applications. Additionally, those looking to use the chip model effectively should have a strong knowledge of the latest technologies, such as artificial intelligence and machine learning.
The XCV400E-7BGG560C chip model is an excellent choice for those looking to develop and popularize the next generation of intelligent robots. With its high-speed operation, low power consumption, and high integration, the XCV400E-7BGG560C is a great choice for those looking to take advantage of the latest technologies. Additionally, those looking to use the chip model effectively will need to have a strong knowledge of the latest technologies and the ability to write and debug code. With the right technical skills, the XCV400E-7BGG560C chip model can be used to create the next generation of intelligent robots.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||