XCV400E-7BGG560I
XCV400E-7BGG560I ECAD Model
XCV400E-7BGG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 129600 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 129600 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCV400E-7BGG560I Datasheet Download
XCV400E-7BGG560I Overview
The chip model XCV400E-7BGG560I has become increasingly popular in the chip industry in recent years. It is a high-performance, low-power, and low-cost chip model, which has attracted the attention of many industry experts. The chip model is designed to meet the needs of a wide range of applications, from consumer electronics to industrial automation.
The chip model XCV400E-7BGG560I is designed with the latest technologies, such as advanced digital signal processing, high-speed data transmission, and low-power operation. It also supports a wide range of communication protocols, including Bluetooth, Wi-Fi, and Zigbee. This makes the chip model suitable for a variety of applications, such as wireless sensor networks, industrial automation, and robotics.
In terms of future development, the chip model XCV400E-7BGG560I has the potential to be upgraded with new technologies. This could include support for new communication protocols, such as 5G, or the integration of AI and machine learning capabilities. The chip model could also be used to develop and popularize future intelligent robots, as it provides the necessary power and performance to support their operations.
In order to effectively use the chip model XCV400E-7BGG560I, it is important to have a team of technical talents who understand the model and its capabilities. These talents should have a deep understanding of the chip model’s architecture, as well as its various communication protocols and digital signal processing algorithms. They should also be familiar with the various software and hardware tools that can be used to develop applications using the chip model.
In conclusion, the chip model XCV400E-7BGG560I has the potential to be applied to a wide range of applications, from consumer electronics to industrial automation. It can also be upgraded with new technologies, such as 5G communication protocols and AI capabilities. In order to effectively use the chip model, it is important to have a team of technical talents who understand the model and its capabilities. With the right team of experts, the chip model XCV400E-7BGG560I can be used to create powerful applications for the future.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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