XCV400E-7FGG676I
XCV400E-7FGG676I
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rohs
Xilinx

XCV400E-7FGG676I


XCV400E-7FGG676I
F20-XCV400E-7FGG676I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-676
FBGA-676

XCV400E-7FGG676I ECAD Model


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XCV400E-7FGG676I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 404
Number of Outputs 404
Number of Logic Cells 10800
Number of Equivalent Gates 129600
Number of CLBs 2400
Combinatorial Delay of a CLB-Max 420 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 2400 CLBS, 129600 GATES
Clock Frequency-Max 400 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-676
Pin Count 676
Reach Compliance Code unknown
HTS Code 8542.39.00.01
ECCN Code 3A991.D

XCV400E-7FGG676I Datasheet Download


XCV400E-7FGG676I Overview



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The original design intention of the XCV400E-7FGG676I chip model was to provide a reliable and efficient solution for a variety of applications. The chip model was designed to be highly reliable and secure, making it ideal for use in mission-critical applications. Furthermore, the chip model was designed to be highly compatible with a wide range of device types, making it ideal for a variety of applications.


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In order to effectively use the XCV400E-7FGG676I chip model, technical talents are needed. The chip model is designed to be highly reliable and secure, making it ideal for use in mission-critical applications. Furthermore, the chip model is capable of being upgraded to provide additional features and capabilities, making it ideal for use in a variety of applications. Therefore, technical talents are needed to ensure that the chip model can be used effectively in a variety of applications.



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