XCV400E-7PQG240C
XCV400E-7PQG240C
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rohs
Xilinx

XCV400E-7PQG240C


XCV400E-7PQG240C
F20-XCV400E-7PQG240C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PLASTIC, QFP-240
PLASTIC, QFP-240

XCV400E-7PQG240C ECAD Model


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XCV400E-7PQG240C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 158
Number of Outputs 158
Number of Logic Cells 10800
Number of Equivalent Gates 129600
Number of CLBs 2400
Combinatorial Delay of a CLB-Max 420 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 2400 CLBS, 129600 GATES
Clock Frequency-Max 400 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PQFP-G240
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 240
Package Body Material PLASTIC/EPOXY
Package Code FQFP
Package Equivalence Code QFP240,1.3SQ,20
Package Shape SQUARE
Package Style FLATPACK, FINE PITCH
Surface Mount YES
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 32 mm
Length 32 mm
Seated Height-Max 4.1 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description PLASTIC, QFP-240
Pin Count 240
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.39.00.01

XCV400E-7PQG240C Datasheet Download


XCV400E-7PQG240C Overview



The chip model XCV400E-7PQG240C is a highly advanced semiconductor device that has been designed to meet the needs of the modern communications industry. It is a multi-purpose chip that is capable of handling a wide range of tasks, from data transmission to signal processing. This chip is designed to provide a low-cost, high-performance solution for a variety of applications.


The XCV400E-7PQG240C is based on the latest cutting-edge technologies and provides the highest level of performance and reliability. It is capable of supporting multiple communication protocols and can be used in a wide range of applications. The chip can be used in both wired and wireless networks and has been designed to be highly scalable and flexible.


The chip is designed to be easily upgradable and can be used in a variety of communication systems. It is also capable of supporting new technologies, such as 5G and high-speed networks, as well as the latest applications. This makes the chip an ideal choice for a wide range of applications, including those in the automotive, medical, and industrial sectors.


In order to ensure that the chip is used in the most efficient way, it is important to understand the product description and specific design requirements of the chip model XCV400E-7PQG240C. This includes the original design intention of the chip and the possibility of future upgrades. It is also important to consider the application environment and whether or not the chip can support new technologies.


In addition, it is important to consider case studies and actual applications of the chip model XCV400E-7PQG240C. This can help to identify any potential issues and provide guidance on how to use the chip in the most effective way. It is also important to consider any safety precautions that may be necessary when using the chip.


In conclusion, the chip model XCV400E-7PQG240C is a highly advanced semiconductor device that can be used in a variety of applications. It is designed to provide a low-cost, high-performance solution for a variety of applications and can be used in both wired and wireless networks. It is also capable of supporting new technologies, such as 5G and high-speed networks, as well as the latest applications. It is important to understand the product description and specific design requirements of the chip model XCV400E-7PQG240C, as well as any potential issues and safety precautions that may be necessary when using the chip.



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