XCV400E-8FG676I
XCV400E-8FG676I ECAD Model
XCV400E-8FG676I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 129600 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 129600 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV400E-8FG676I Datasheet Download
XCV400E-8FG676I Overview
The XCV400E-8FG676I chip model is a highly advanced and innovative product that has been developed to meet the needs of the modern digital world. It is an integrated circuit that has been designed to provide users with a wide range of features and capabilities that can be used to improve their performance and efficiency. This chip model is capable of providing users with a wide range of performance benefits, such as improved power efficiency, faster clock speeds, higher memory bandwidth, and improved signal-to-noise ratio.
The XCV400E-8FG676I chip model has been designed to meet the demands of the modern digital world, and its features and capabilities make it ideal for a variety of applications. It is capable of providing users with a wide range of performance benefits, such as improved power efficiency, faster clock speeds, higher memory bandwidth, and improved signal-to-noise ratio. This chip model can be used in a variety of industries, such as telecommunications, automotive, industrial, and consumer electronics.
The XCV400E-8FG676I chip model is expected to remain in high demand in the coming years, as its features and capabilities make it an ideal solution for a variety of applications. This chip model can be used in a variety of industries, such as telecommunications, automotive, industrial, and consumer electronics. It is capable of providing users with a wide range of performance benefits, such as improved power efficiency, faster clock speeds, higher memory bandwidth, and improved signal-to-noise ratio.
The original design intention of the XCV400E-8FG676I chip model was to provide users with a wide range of features and capabilities that can be used to improve their performance and efficiency. This chip model is capable of providing users with a wide range of performance benefits, such as improved power efficiency, faster clock speeds, higher memory bandwidth, and improved signal-to-noise ratio. It is also capable of supporting future upgrades, making it an ideal solution for a variety of applications.
The XCV400E-8FG676I chip model is capable of being applied to a variety of advanced communication systems. It is capable of providing users with a wide range of performance benefits, such as improved power efficiency, faster clock speeds, higher memory bandwidth, and improved signal-to-noise ratio. This chip model is also capable of supporting future upgrades, making it an ideal solution for a variety of applications.
The XCV400E-8FG676I chip model is also capable of being applied to a variety of networks and intelligent scenarios. It is capable of providing users with a wide range of performance benefits, such as improved power efficiency, faster clock speeds, higher memory bandwidth, and improved signal-to-noise ratio. This chip model is also capable of supporting future upgrades, making it an ideal solution for a variety of applications. It is also capable of being used in the era of fully intelligent systems, making it an ideal solution for a variety of applications.
In conclusion, the XCV400E-8FG676I chip model is a highly advanced and innovative product that has been designed to meet the demands of the modern digital world. It is capable of providing users with a wide range of performance benefits, such as improved power efficiency, faster clock speeds, higher memory bandwidth, and improved signal-to-noise ratio. This chip model is expected to remain in high demand in the coming years, as its features and capabilities make it an ideal solution for a variety of applications. It is also capable of supporting future upgrades, making it an ideal solution for a variety of applications. It is also capable of being applied to a variety of advanced communication systems, networks, and intelligent scenarios, making it an ideal solution for a variety of applications.
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