XCV50-4BGG256I
XCV50-4BGG256I ECAD Model
XCV50-4BGG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 57906 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 57906 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV50-4BGG256I Datasheet Download
XCV50-4BGG256I Overview
The chip model XCV50-4BGG256I is a high-performance chip designed for digital signal processing, embedded processing, and image processing. It is capable of handling complex data streams with low power consumption and minimal latency. The chip is programmed using HDL language, which is an industry standard for chip designs. It has been widely used in many applications, such as automotive, industrial automation, medical imaging, and consumer electronics.
In terms of industry trends, the chip model XCV50-4BGG256I has seen a rise in popularity due to its low power consumption and high performance. This has led to increased demand for the chip in various industries, such as automotive, industrial automation, and medical imaging. As the demand for the chip grows, so does the need to develop new technologies that can support the chip's application environment.
The product description of the chip model XCV50-4BGG256I outlines the features and specifications of the chip. It is designed to handle complex data streams with minimal latency and low power consumption. The chip is programmed using HDL language, which is an industry standard for chip designs. It is highly reliable and efficient, making it suitable for a variety of applications.
In terms of design requirements, the chip model XCV50-4BGG256I must be able to handle complex data streams with minimal latency and low power consumption. The chip must also be programmed using HDL language, which is an industry standard for chip designs. Additionally, the chip must be able to support the application environment, which may require the use of new technologies.
Case studies and precautions should be taken when designing the chip model XCV50-4BGG256I. It is important to ensure that the chip is capable of handling complex data streams with minimal latency and low power consumption. Additionally, the chip must be programmed using HDL language, which is an industry standard for chip designs. Finally, the chip must be able to support the application environment, which may require the use of new technologies.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||