XCV812E-8FGG900C
XCV812E-8FGG900C
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rohs
Xilinx

XCV812E-8FGG900C


XCV812E-8FGG900C
F20-XCV812E-8FGG900C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

XCV812E-8FGG900C ECAD Model


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XCV812E-8FGG900C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Equivalent Gates 254016
Number of CLBs 4704
Combinatorial Delay of a CLB-Max 400 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 4704 CLBS, 254016 GATES
Clock Frequency-Max 416 MHz
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B900
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 31 mm
Length 31 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA,
Pin Count 900
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D

XCV812E-8FGG900C Datasheet Download


XCV812E-8FGG900C Overview



The XCV812E-8FGG900C chip model is a high-performance digital signal processing, embedded processing, and image processing tool. It is designed to be used with HDL language, a hardware description language used to program logic circuits. This chip model is a great choice for those looking for a reliable and efficient way to process data.


The XCV812E-8FGG900C chip model is well-suited for a variety of applications, including embedded systems, consumer electronics, and industrial automation. The chip model is also capable of handling large amounts of data quickly and efficiently. It is also capable of providing high-quality images and video, making it a great choice for multimedia applications.


The chip model is also becoming increasingly popular in the industrial sector due to its ability to handle high-performance tasks. This chip model is becoming increasingly popular for its ability to handle large amounts of data quickly and efficiently. It is also capable of providing high-quality images and video, making it a great choice for multimedia applications.


The advantages of the XCV812E-8FGG900C chip model include its low power consumption, low cost, and fast processing speeds. It is also very reliable and can be used in a variety of applications. The chip model is also highly compatible with existing hardware, making it easy to integrate into existing systems.


The demand for the XCV812E-8FGG900C chip model is expected to remain strong in the future. As more and more applications require the use of this chip model, its demand is likely to increase. It is also likely that the chip model will continue to be used in new and innovative ways as technology advances.


The application environment of the XCV812E-8FGG900C chip model may require the use of new technologies to support its use. This could include the use of artificial intelligence, machine learning, and other advanced technologies. As technology advances, the chip model will be able to handle more complex tasks and provide better results.


Overall, the XCV812E-8FGG900C chip model is a great choice for those looking for a reliable and efficient way to process data. Its low power consumption, low cost, and fast processing speeds make it an attractive choice for a variety of applications. The chip model is also highly compatible with existing hardware, making it easy to integrate into existing systems. As technology advances, the chip model will be able to handle more complex tasks and provide better results, making it an even more attractive choice for those looking for a reliable and efficient way to process data.



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