

XCZU17EG-2FFVD1760I
XCZU17EG-2FFVD1760I ECAD Model
XCZU17EG-2FFVD1760I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B1760 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA1760,42X42,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | XILINX |
XCZU17EG-2FFVD1760I Datasheet Download
XCZU17EG-2FFVD1760I Overview
The XCZU17EG-2FFVD1760I chip model is a cutting-edge technology designed to meet the increasingly complex needs of modern communication systems. It is a high-performance, low-power, and cost-effective solution that provides a wide range of features, including high-speed network interfaces, advanced security, and advanced processing capabilities. It is ideal for a variety of applications, ranging from consumer electronics to industrial automation.
The XCZU17EG-2FFVD1760I chip model is designed to meet the ever-changing needs of the communication industry. It is equipped with a wide range of features, including advanced security, high-speed network interfaces, and advanced processing capabilities. It is also designed to be highly scalable and flexible, allowing it to be upgraded to meet the changing needs of the industry. In addition, it is designed to be highly efficient, providing superior performance at a lower cost.
The XCZU17EG-2FFVD1760I chip model is also designed to be used in a wide range of intelligent scenarios. It is capable of supporting the latest technologies, such as artificial intelligence and machine learning, as well as more traditional technologies, such as voice recognition and facial recognition. It is also capable of supporting the latest network protocols, such as 5G and Wi-Fi 6, as well as more traditional network protocols, such as Ethernet and USB. This makes it an ideal solution for a variety of applications, ranging from home automation to industrial automation.
The XCZU17EG-2FFVD1760I chip model is also designed to be used in the era of fully intelligent systems. It is capable of supporting a wide range of technologies, such as natural language processing, computer vision, and robotics, as well as more traditional technologies, such as voice recognition and facial recognition. This makes it an ideal solution for a variety of applications, ranging from home automation to industrial automation.
In conclusion, the XCZU17EG-2FFVD1760I chip model is a cutting-edge technology designed to meet the increasingly complex needs of modern communication systems. It is highly efficient, providing superior performance at a lower cost, and highly scalable and flexible, allowing it to be upgraded to meet the changing needs of the industry. It is also designed to be used in a wide range of intelligent scenarios, making it an ideal solution for a variety of applications, ranging from home automation to industrial automation.
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2,403 In Stock
Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $7,876.9200 | $7,876.9200 |
10+ | $7,719.3816 | $77,193.8160 |
100+ | $7,561.8432 | $756,184.3200 |
500+ | $7,483.0740 | $3,741,537.0000 |
1000+ | $7,325.5356 | $7,325,535.6000 |
The price is for reference only, please refer to the actual quotation! |