XCZU17EG-2FFVD1760I
XCZU17EG-2FFVD1760I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs
AMD Xilinx

XCZU17EG-2FFVD1760I


XCZU17EG-2FFVD1760I
F20-XCZU17EG-2FFVD1760I
Active
CMOS, BGA, BGA1760,42X42,40
BGA, BGA1760,42X42,40

XCZU17EG-2FFVD1760I ECAD Model


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XCZU17EG-2FFVD1760I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1760
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1760,42X42,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU17EG-2FFVD1760I Datasheet Download


XCZU17EG-2FFVD1760I Overview



The XCZU17EG-2FFVD1760I chip model is a cutting-edge technology designed to meet the increasingly complex needs of modern communication systems. It is a high-performance, low-power, and cost-effective solution that provides a wide range of features, including high-speed network interfaces, advanced security, and advanced processing capabilities. It is ideal for a variety of applications, ranging from consumer electronics to industrial automation.


The XCZU17EG-2FFVD1760I chip model is designed to meet the ever-changing needs of the communication industry. It is equipped with a wide range of features, including advanced security, high-speed network interfaces, and advanced processing capabilities. It is also designed to be highly scalable and flexible, allowing it to be upgraded to meet the changing needs of the industry. In addition, it is designed to be highly efficient, providing superior performance at a lower cost.


The XCZU17EG-2FFVD1760I chip model is also designed to be used in a wide range of intelligent scenarios. It is capable of supporting the latest technologies, such as artificial intelligence and machine learning, as well as more traditional technologies, such as voice recognition and facial recognition. It is also capable of supporting the latest network protocols, such as 5G and Wi-Fi 6, as well as more traditional network protocols, such as Ethernet and USB. This makes it an ideal solution for a variety of applications, ranging from home automation to industrial automation.


The XCZU17EG-2FFVD1760I chip model is also designed to be used in the era of fully intelligent systems. It is capable of supporting a wide range of technologies, such as natural language processing, computer vision, and robotics, as well as more traditional technologies, such as voice recognition and facial recognition. This makes it an ideal solution for a variety of applications, ranging from home automation to industrial automation.


In conclusion, the XCZU17EG-2FFVD1760I chip model is a cutting-edge technology designed to meet the increasingly complex needs of modern communication systems. It is highly efficient, providing superior performance at a lower cost, and highly scalable and flexible, allowing it to be upgraded to meet the changing needs of the industry. It is also designed to be used in a wide range of intelligent scenarios, making it an ideal solution for a variety of applications, ranging from home automation to industrial automation.



4,202 In Stock


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Unit Price: $6,301.536
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $5,860.4285 $5,860.4285
10+ $5,797.4131 $57,974.1312
100+ $5,482.3363 $548,233.6320
1000+ $5,167.2595 $2,583,629.7600
10000+ $4,726.1520 $4,726,152.0000
The price is for reference only, please refer to the actual quotation!

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