XCZU7EV-L1FFVF1517I
XCZU7EV-L1FFVF1517I
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rohs
Xilinx

XCZU7EV-L1FFVF1517I


XCZU7EV-L1FFVF1517I
F20-XCZU7EV-L1FFVF1517I
Active
CMOS, BGA, BGA1517,39X39,40
BGA, BGA1517,39X39,40

XCZU7EV-L1FFVF1517I ECAD Model


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XCZU7EV-L1FFVF1517I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 720 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Supply Voltage-Max 742 mV
Supply Voltage-Min 698 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1517
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1517,39X39,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU7EV-L1FFVF1517I Datasheet Download


XCZU7EV-L1FFVF1517I Overview



Chip model XCZU7EV-L1FFVF1517I is a high-performance, low-power, and cost-effective field programmable gate array (FPGA) with a wide range of applications. It has been widely used in various industries, such as industrial automation, healthcare, automotive, and aerospace. This chip model is equipped with multiple features and functions, such as high-speed transceivers, hardened memory controllers, high-performance DSP blocks, and multiple I/Os.


The demand for chip model XCZU7EV-L1FFVF1517I is expected to continue to grow in the future as the industry trends towards more advanced technology. With its high-performance and low-power design, this chip model is expected to be used in more applications that require high-speed data processing and low power consumption. Additionally, the chip model is expected to be used in the development of new technologies, such as artificial intelligence (AI), machine learning (ML), and the Internet of Things (IoT).


In terms of the possible future applications of the chip model XCZU7EV-L1FFVF1517I, it is expected to be used in networks and intelligent scenarios. For example, it can be used for the development of AI-enabled networks, such as autonomous vehicles and smart homes. Additionally, this chip model can be used for the development of ML-enabled networks, such as facial recognition and natural language processing. It can also be used in the era of fully intelligent systems, such as smart cities and intelligent robots.


In conclusion, chip model XCZU7EV-L1FFVF1517I is a high-performance, low-power, and cost-effective FPGA with a wide range of applications. The demand for this chip model is expected to continue to grow in the future due to its high-performance and low-power design. It is expected to be used in networks and intelligent scenarios, such as autonomous vehicles, smart homes, facial recognition, natural language processing, and intelligent robots. The chip model can also be used in the era of fully intelligent systems, such as smart cities and intelligent robots.



2,593 In Stock


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Unit Price: $2,021.02368
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,879.5520 $1,879.5520
10+ $1,859.3418 $18,593.4179
100+ $1,758.2906 $175,829.0602
1000+ $1,657.2394 $828,619.7088
10000+ $1,515.7678 $1,515,767.7600
The price is for reference only, please refer to the actual quotation!

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