XCZU7EV-L1FFVF1517I
XCZU7EV-L1FFVF1517I ECAD Model
XCZU7EV-L1FFVF1517I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1517 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU7EV-L1FFVF1517I Datasheet Download
XCZU7EV-L1FFVF1517I Overview
Chip model XCZU7EV-L1FFVF1517I is a high-performance, low-power, and cost-effective field programmable gate array (FPGA) with a wide range of applications. It has been widely used in various industries, such as industrial automation, healthcare, automotive, and aerospace. This chip model is equipped with multiple features and functions, such as high-speed transceivers, hardened memory controllers, high-performance DSP blocks, and multiple I/Os.
The demand for chip model XCZU7EV-L1FFVF1517I is expected to continue to grow in the future as the industry trends towards more advanced technology. With its high-performance and low-power design, this chip model is expected to be used in more applications that require high-speed data processing and low power consumption. Additionally, the chip model is expected to be used in the development of new technologies, such as artificial intelligence (AI), machine learning (ML), and the Internet of Things (IoT).
In terms of the possible future applications of the chip model XCZU7EV-L1FFVF1517I, it is expected to be used in networks and intelligent scenarios. For example, it can be used for the development of AI-enabled networks, such as autonomous vehicles and smart homes. Additionally, this chip model can be used for the development of ML-enabled networks, such as facial recognition and natural language processing. It can also be used in the era of fully intelligent systems, such as smart cities and intelligent robots.
In conclusion, chip model XCZU7EV-L1FFVF1517I is a high-performance, low-power, and cost-effective FPGA with a wide range of applications. The demand for this chip model is expected to continue to grow in the future due to its high-performance and low-power design. It is expected to be used in networks and intelligent scenarios, such as autonomous vehicles, smart homes, facial recognition, natural language processing, and intelligent robots. The chip model can also be used in the era of fully intelligent systems, such as smart cities and intelligent robots.
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2,593 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,879.5520 | $1,879.5520 |
| 10+ | $1,859.3418 | $18,593.4180 |
| 100+ | $1,758.2906 | $175,829.0619 |
| 1000+ | $1,657.2394 | $828,619.7170 |
| 10000+ | $1,515.7678 | $1,515,767.7750 |
| The price is for reference only, please refer to the actual quotation! | ||