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900-FCBGA (31x31)


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XCZU9EG-1FFVC900E Attributes

Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Samacsys Manufacturer XILINX

XCZU9EG-1FFVC900E Datasheet Download

XCZU9EG-1FFVC900E Overview

The XCZU9EG-1FFVC900E chip model is a powerful tool for a variety of applications, from high-performance digital signal processing to embedded processing and image processing. It is designed to be used with the HDL language, and its original design intention was to provide a powerful and reliable platform for advanced communication systems.

The XCZU9EG-1FFVC900E chip model has a wide range of features and capabilities, making it suitable for a variety of applications. It has a high-speed, low-power architecture that makes it ideal for digital signal processing applications. It also has a wide range of peripherals, including Ethernet, USB, and other high-speed communication interfaces. It also has a large number of memory resources and a wide range of on-chip logic, making it suitable for embedded processing and image processing.

The product description of the XCZU9EG-1FFVC900E chip model includes a detailed list of its features and capabilities, along with instructions on how to use it. It also includes a detailed description of the design requirements, including the clock speed, memory size, and other parameters. The product description also includes a list of case studies and best practices for using the chip model.

The XCZU9EG-1FFVC900E chip model is designed for flexibility and upgradability. It is designed to be easily upgraded with new features and capabilities, allowing it to be used for a wide range of applications. It is also designed to be able to handle advanced communication systems, making it suitable for a variety of applications.

When using the XCZU9EG-1FFVC900E chip model, it is important to follow the product description and design requirements closely. It is also important to be aware of the limitations of the chip model, as well as any potential risks associated with using it. It is also important to be aware of the potential for future upgrades and changes, as these could affect the performance of the chip model.

1,603 In Stock

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Unit Price: $2,398.50
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Pricing (USD)

QTY Unit Price Ext Price
1+ $2,398.5000 $2,398.5000
10+ $2,350.5300 $23,505.3000
100+ $2,302.5600 $230,256.0000
500+ $2,278.5750 $1,139,287.5000
1000+ $2,230.6050 $2,230,605.0000
The price is for reference only, please refer to the actual quotation!

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