XCZU9EG-L1FFVB1156I
XCZU9EG-L1FFVB1156I
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rohs
Xilinx

XCZU9EG-L1FFVB1156I


XCZU9EG-L1FFVB1156I
F20-XCZU9EG-L1FFVB1156I
Active
IC SOC CORTEX-A53 1156FCBGA
1156-FCBGA (35x35)

XCZU9EG-L1FFVB1156I ECAD Model


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XCZU9EG-L1FFVB1156I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 720 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Supply Voltage-Max 742 mV
Supply Voltage-Min 698 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1156
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FCBGA-1156
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Samacsys Manufacturer XILINX

XCZU9EG-L1FFVB1156I Datasheet Download


XCZU9EG-L1FFVB1156I Overview



The XCZU9EG-L1FFVB1156I is a high-performance chip model that is suitable for a variety of applications, such as digital signal processing, embedded processing, and image processing. It is designed to use the HDL language, which is an advanced language used in the development of digital systems. This model offers a number of advantages over its competitors, including a high level of processing power, low power consumption, and a wide range of features.


The XCZU9EG-L1FFVB1156I is an ideal choice for those who require a powerful and reliable chip model. It is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. The chip model also offers a number of features that make it a great choice for those who need a reliable and powerful chip model. For example, the chip model has a low power consumption, which makes it an ideal choice for those looking to save on energy costs.


The XCZU9EG-L1FFVB1156I is expected to be in high demand in the near future, due to its advanced features and capabilities. It is also expected to be a popular choice for those who require a reliable and powerful chip model for their applications. As the demand for this chip model increases, it is likely that the price of the chip model will decrease as well.


When it comes to designing a system using the XCZU9EG-L1FFVB1156I chip model, there are a few important considerations to keep in mind. First, it is important to ensure that the design is compatible with the HDL language, as this is the language used to program the chip model. Additionally, it is important to consider the specific design requirements of the chip model, such as the memory size, clock speed, and power consumption. It is also important to consider any additional features that may be required for the specific application.


Finally, it is also important to consider any case studies and precautions when designing a system using the XCZU9EG-L1FFVB1156I chip model. Case studies can provide valuable insight into how the chip model performs in a variety of applications, and can help to identify any potential issues. Additionally, precautions should be taken to ensure that the system is properly tested and verified before it is deployed. This will help to ensure that the system is reliable and performs as expected.



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Unit Price: $3,793.32
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $3,793.3200 $3,793.3200
10+ $3,717.4536 $37,174.5360
100+ $3,641.5872 $364,158.7200
500+ $3,603.6540 $1,801,827.0000
1000+ $3,527.7876 $3,527,787.6000
The price is for reference only, please refer to the actual quotation!

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