EP3SL200H780C3
EP3SL200H780C3 ECAD Model
EP3SL200H780C3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 200000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 33 mm | |
| Length | 33 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA780,28X28,40 | |
| Pin Count | 780 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL200H780C3 Overview
The chip model EP3SL200H780C3 is a high-performance, low-power FPGA that is suitable for a variety of applications. It is designed to be used in high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It is also capable of being used in advanced communication systems.
The EP3SL200H780C3 was designed to be a versatile, high-performance FPGA, with a focus on low power consumption and a wide range of applications. It is equipped with a high-speed transceiver, high-performance DSP blocks, and a variety of memory interfaces, making it suitable for a wide range of applications. It is also capable of being upgraded in the future, allowing for the addition of new features and capabilities.
The product description of the EP3SL200H780C3 outlines the features and specifications of the device. It has a maximum operating frequency of 200 MHz, a total of 780 I/O pins, and a total of 200K logic elements. It also has a variety of memory interfaces, including DDR3, QDRII, and RLDRAM2. In addition, it has a variety of I/O interfaces, including PCI Express, USB, and HDMI.
In order to use the EP3SL200H780C3 correctly, there are a few precautions to be aware of. First, it is important to ensure that the power supply is adequate for the device. In addition, it is important to ensure that the device is properly cooled, as it can get very hot when operating at high speeds. Finally, it is important to ensure that the design is optimized for the device, as this will ensure that it runs as efficiently as possible.
Case studies of the EP3SL200H780C3 have been conducted in a variety of applications, such as image processing, digital signal processing, and embedded processing. In all of these applications, the device has proven to be a reliable and powerful solution. In addition, it has been used in advanced communication systems, where it has been able to provide high-speed data transfer and reliable communication.
The EP3SL200H780C3 is a versatile, high-performance FPGA that is suitable for a variety of applications. It is designed to be used in high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It is also capable of being upgraded in the future, allowing for the addition of new features and capabilities. In order to ensure that the device is used correctly, it is important to ensure that the power supply is adequate, that the device is properly cooled, and that the design is optimized for the device. Case studies have shown that the EP3SL200H780C3 is a reliable and powerful solution for a variety of applications, including advanced communication systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||