EP3SL340H1152C2
EP3SL340H1152C2 ECAD Model
EP3SL340H1152C2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 337500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 800 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.9 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | HBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL340H1152C2 Datasheet Download
EP3SL340H1152C2 Overview
The chip model EP3SL340H1152C2 is an advanced integrated circuit designed for a variety of applications. It is a high-performance, low-power, low-cost solution for embedded systems. The chip is designed to provide high performance and low power consumption, making it ideal for use in a wide range of applications.
The EP3SL340H1152C2 has a number of features that make it ideal for embedded system applications. It has a high-speed processor core, an integrated memory controller, a wide range of peripherals, and a variety of communication interfaces. The chip also supports a range of advanced technologies, including advanced power management, advanced security, and advanced debugging capabilities.
The EP3SL340H1152C2 is designed to meet the needs of a wide range of applications. It is capable of supporting a variety of operating systems, including Windows, Linux, and Android. It is also capable of supporting a wide range of embedded applications, including industrial control, medical devices, and consumer electronics. The chip also supports a variety of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and ZigBee.
The EP3SL340H1152C2 is a highly reliable and cost-effective solution for embedded systems. It is designed to be robust and reliable, with a low power consumption and a high performance. The chip is also designed to be highly scalable, allowing it to be used in a variety of applications.
In terms of industry trends, the EP3SL340H1152C2 is expected to be in high demand in the future. The chip is highly suitable for a variety of applications, and its low cost and high performance make it an ideal choice for embedded systems. The chip is also expected to be used in a variety of new applications, as it is capable of supporting a variety of advanced technologies.
The product description and design requirements of the EP3SL340H1152C2 are available on the manufacturer's website. The manufacturer also provides a number of case studies and guidelines to help customers make the best use of the chip. Customers should also be aware of the precautions that should be taken when using the chip, such as ensuring that the chip is properly powered, and that the correct operating environment is provided.
In conclusion, the EP3SL340H1152C2 is a highly reliable and cost-effective solution for embedded systems. It is designed to provide high performance and low power consumption, making it ideal for a wide range of applications. The chip is expected to be in high demand in the future, as it is capable of supporting a variety of advanced technologies. The product description and design requirements of the chip are available on the manufacturer's website, along with a number of case studies and guidelines to help customers make the best use of the chip. Customers should also be aware of the precautions that should be taken when using the chip, such as ensuring that the chip is properly powered, and that the correct operating environment is provided.
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776 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $19,962.5490 | $19,962.5490 |
| 10+ | $19,563.2980 | $195,632.9802 |
| 100+ | $19,164.0470 | $1,916,404.7040 |
| 500+ | $18,964.4216 | $9,482,210.7750 |
| 1000+ | $18,565.1706 | $18,565,170.5700 |
| The price is for reference only, please refer to the actual quotation! | ||