EP3SL340H1152I3G
EP3SL340H1152I3G ECAD Model
EP3SL340H1152I3G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 337500 | |
| Number of CLBs | 13500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 13500 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | HBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL340H1152I3G Datasheet Download
EP3SL340H1152I3G Overview
The chip model EP3SL340H1152I3G is a high-performance digital signal processing processor that is suitable for embedded processing, image processing, and other related applications. It is designed to be used with the HDL language, a hardware description language that is commonly used in the development of digital systems. The model is capable of providing high-performance computing power and is expected to be used in more advanced applications in the future.
The EP3SL340H1152I3G is designed to provide high-performance computing power and flexibility. It is equipped with a wide range of features that make it suitable for a variety of applications. The chip is equipped with a high-speed memory interface, an advanced power management unit, and a high-performance processor core. The chip also supports a wide range of communication protocols, making it suitable for a variety of communication systems.
The EP3SL340H1152I3G is designed to be a high-performance processor that is suitable for a variety of applications. The chip is designed to be both powerful and flexible, allowing it to be used in a variety of applications. The chip is also designed to be upgradeable, allowing it to be used in more advanced applications in the future. The chip is also designed to be able to support advanced communication systems, making it suitable for a variety of communication systems.
The EP3SL340H1152I3G is expected to be used in more and more applications in the future, as it is capable of providing high-performance computing power and is upgradeable. The chip is also expected to be used in more advanced communication systems, as it is designed to be able to support a wide range of communication protocols. The chip is also expected to be used in more image processing applications, as it is designed to be able to handle high-performance image processing tasks.
Overall, the chip model EP3SL340H1152I3G is designed to be a high-performance digital signal processing processor that is suitable for embedded processing, image processing, and other related applications. It is designed to be used with the HDL language, a hardware description language that is commonly used in the development of digital systems. The model is capable of providing high-performance computing power and is expected to be used in more advanced applications in the future. The chip is also expected to be used in more advanced communication systems, as it is designed to be able to support a wide range of communication protocols. The chip is also expected to be used in more image processing applications, as it is designed to be able to handle high-performance image processing tasks.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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