EPF10K50EFC484-3
EPF10K50EFC484-3 ECAD Model
EPF10K50EFC484-3 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 800 ps | |
| Number of Inputs | 254 | |
| Number of Outputs | 254 | |
| Number of Logic Cells | 2880 | |
| Number of I/O Lines | 254 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 254 I/O | |
| Additional Feature | 2880 LOGIC ELEMENTS | |
| Clock Frequency-Max | 140 MHz | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | 23 X 23 MM, 1 MM PITCH, FINE LINE, BGA-484 | |
| Pin Count | 484 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel |
EPF10K50EFC484-3 Overview
The chip model EPF10K50EFC484-3 is a high-performance, low-power field-programmable gate array (FPGA) device developed by Altera Corporation. It is based on the Stratix 10K architecture and is designed to provide the highest levels of performance, flexibility and power efficiency. This chip model is designed to provide a wide range of features such as high-speed transceivers, high-speed memory, embedded processors, and advanced I/O features.
The chip model EPF10K50EFC484-3 is well suited for a variety of applications, such as communications, networking, industrial automation, and military/aerospace applications. It is designed to provide the highest levels of performance while consuming minimal power. The chip model is also designed to be highly scalable, allowing users to customize their designs to meet their specific needs.
The chip model EPF10K50EFC484-3 offers a wide range of features such as high-speed transceivers, high-speed memory, embedded processors, and advanced I/O features. It is designed to provide the highest levels of performance while consuming minimal power. The chip model is also designed to be highly scalable, allowing users to customize their designs to meet their specific needs.
The chip model EPF10K50EFC484-3 is expected to become increasingly popular in the future due to its features and flexibility. The chip model is designed to be highly reliable and cost-effective, making it an ideal choice for a wide range of applications. In addition, the chip model is designed to be easily upgradable and can be used in advanced communication systems.
The original design intention of the chip model EPF10K50EFC484-3 was to provide a high-performance, low-power FPGA device that is highly reliable and cost-effective. The chip model is designed to be highly scalable and customizable, allowing users to customize their designs to meet their specific needs. In addition, the chip model is designed to be easily upgradable and can be used in advanced communication systems.
In conclusion, the chip model EPF10K50EFC484-3 is a high-performance, low-power FPGA device that is designed to provide the highest levels of performance, flexibility and power efficiency. It is well suited for a variety of applications, such as communications, networking, industrial automation, and military/aerospace applications. The chip model is expected to become increasingly popular in the future due to its features and flexibility. The chip model is designed to be highly reliable and cost-effective, making it an ideal choice for a wide range of applications. The chip model is also designed to be easily upgradable and can be used in advanced communication systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||