EPF10K50EFC484-3
EPF10K50EFC484-3
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rohs
Intel Corporation

EPF10K50EFC484-3


EPF10K50EFC484-3
F18-EPF10K50EFC484-3
Active
IC FPGA 220 I/O 484FBGA
484-FBGA (23x23)

EPF10K50EFC484-3 ECAD Model


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EPF10K50EFC484-3 Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Supply Voltage-Nom 2.5 V
Propagation Delay 800 ps
Number of Inputs 254
Number of Outputs 254
Number of Logic Cells 2880
Number of I/O Lines 254
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 254 I/O
Additional Feature 2880 LOGIC ELEMENTS
Clock Frequency-Max 140 MHz
Output Function MIXED
Power Supplies 2.5,2.5/3.3 V
Supply Voltage-Max 2.7 V
Supply Voltage-Min 2.3 V
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 220
Time@Peak Reflow Temperature-Max (s) 20
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.1 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description 23 X 23 MM, 1 MM PITCH, FINE LINE, BGA-484
Pin Count 484
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Samacsys Manufacturer Intel

EPF10K50EFC484-3 Overview



The chip model EPF10K50EFC484-3 is a high-performance, low-power field-programmable gate array (FPGA) device developed by Altera Corporation. It is based on the Stratix 10K architecture and is designed to provide the highest levels of performance, flexibility and power efficiency. This chip model is designed to provide a wide range of features such as high-speed transceivers, high-speed memory, embedded processors, and advanced I/O features.


The chip model EPF10K50EFC484-3 is well suited for a variety of applications, such as communications, networking, industrial automation, and military/aerospace applications. It is designed to provide the highest levels of performance while consuming minimal power. The chip model is also designed to be highly scalable, allowing users to customize their designs to meet their specific needs.


The chip model EPF10K50EFC484-3 offers a wide range of features such as high-speed transceivers, high-speed memory, embedded processors, and advanced I/O features. It is designed to provide the highest levels of performance while consuming minimal power. The chip model is also designed to be highly scalable, allowing users to customize their designs to meet their specific needs.


The chip model EPF10K50EFC484-3 is expected to become increasingly popular in the future due to its features and flexibility. The chip model is designed to be highly reliable and cost-effective, making it an ideal choice for a wide range of applications. In addition, the chip model is designed to be easily upgradable and can be used in advanced communication systems.


The original design intention of the chip model EPF10K50EFC484-3 was to provide a high-performance, low-power FPGA device that is highly reliable and cost-effective. The chip model is designed to be highly scalable and customizable, allowing users to customize their designs to meet their specific needs. In addition, the chip model is designed to be easily upgradable and can be used in advanced communication systems.


In conclusion, the chip model EPF10K50EFC484-3 is a high-performance, low-power FPGA device that is designed to provide the highest levels of performance, flexibility and power efficiency. It is well suited for a variety of applications, such as communications, networking, industrial automation, and military/aerospace applications. The chip model is expected to become increasingly popular in the future due to its features and flexibility. The chip model is designed to be highly reliable and cost-effective, making it an ideal choice for a wide range of applications. The chip model is also designed to be easily upgradable and can be used in advanced communication systems.



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