EPF10K50SBC356-1X
EPF10K50SBC356-1X
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rohs
Intel

EPF10K50SBC356-1X


EPF10K50SBC356-1X
F18-EPF10K50SBC356-1X
Active
IC FPGA 220 I/O 356BGA
356-BGA (35x35)

EPF10K50SBC356-1X ECAD Model


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EPF10K50SBC356-1X Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Supply Voltage-Nom 2.5 V
Propagation Delay 300 ps
Number of Inputs 220
Number of Outputs 220
Number of Logic Cells 2880
Number of I/O Lines 220
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 220 I/O
Output Function MIXED
Power Supplies 2.5,2.5/3.3 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B356
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 220
Number of Terminals 356
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA356,26X26,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 1.63 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description 35 X 35 MM, 1.27 MM PITCH, BGA-356
Pin Count 356
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

EPF10K50SBC356-1X Overview



The chip model EPF10K50SBC356-1X is a powerful and advanced integrated circuit designed for high-performance digital signal processing, embedded processing, image processing, and other related applications. This model is powered by a high-performance Field Programmable Gate Array (FPGA) and requires the use of HDL language for programming.


The EPF10K50SBC356-1X chip model provides a wide range of advantages to users, including high-speed processing, low power consumption, and flexibility in design. It also offers a variety of features, such as high-speed I/O, embedded memory, and multiple clock domains. This model is especially suitable for applications that require high-speed data processing, such as image processing, video processing, and audio processing.


The demand for the EPF10K50SBC356-1X chip model is expected to increase in the coming years, especially in industries that require high-performance digital signal processing. This is due to the increasing demand for faster and more efficient data processing. In addition, this model is also suitable for applications that require flexibility in design, such as embedded systems and industrial automation.


The product description of the EPF10K50SBC356-1X chip model includes its various features and specifications. It has an FPGA operating at 250MHz, a total of 10,000 logic cells, and a maximum of 8,000 embedded RAM blocks. It also has two banks of 256-bit wide block RAMs and two banks of 72-bit wide distributed RAMs. The chip model also has a total of 56 dedicated I/O pins, four high-speed transceivers, and two high-speed serializers.


In terms of design, the EPF10K50SBC356-1X chip model requires the use of HDL language for programming. This language is used to define the internal structure of the chip, such as the logic gates, multiplexers, and other components. It also allows for the easy customization of the chip for different applications.


To illustrate the use of the EPF10K50SBC356-1X chip model, a case study of an image processing application is presented. In this application, the chip model is used to capture images from a camera and process them in real-time. The chip model is programmed using HDL language to define the logic gates and multiplexers, and to configure the embedded memory blocks.


When using the EPF10K50SBC356-1X chip model, it is important to take into consideration the power consumption and the temperature of the device. If the device is exposed to high temperatures, it may cause damage to the chip. Therefore, it is important to ensure that the device is kept in a cool and dry environment.


In conclusion, the EPF10K50SBC356-1X chip model is an advanced integrated circuit designed for high-performance digital signal processing, embedded processing, image processing, and other related applications. It provides users with a wide range of advantages, such as high-speed processing, low power consumption, and flexibility in design. Its demand is expected to increase in the coming years due to the increasing demand for faster and more efficient data processing. The chip model requires the use of HDL language for programming, and a case study of an image processing application is presented to illustrate its use. It is important to take into consideration the power consumption and the temperature of the device when using the EPF10K50SBC356-1X chip model.



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