LFX1200EC-03F900I
LFX1200EC-03F900I ECAD Model
LFX1200EC-03F900I Attributes
| Type | Description | Select |
|---|---|---|
| Mfr | Lattice Semiconductor Corporation | |
| Series | ispXPGA® | |
| Package | Tray | |
| Number of Logic Elements/Cells | 15376 | |
| Total RAM Bits | 423936 | |
| Number of I/O | 496 | |
| Number of Gates | 1250000 | |
| Voltage - Supply | 1.65V ~ 1.95V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 105°C (TJ) | |
| Package / Case | 900-BBGA | |
| Supplier Device Package | 900-FPBGA (31x31) | |
| Base Product Number | LFX1200 |
LFX1200EC-03F900I Datasheet Download
LFX1200EC-03F900I Overview
The LFX1200EC-03F900I is a single-chip solution for low-power embedded applications. It is designed for use in a variety of industrial, consumer, automotive, and other embedded applications.
The chip is based on a 32-bit ARM Cortex-M4F processor core, which is clocked at up to 120 MHz. It is a highly integrated single-chip solution, which includes an integrated memory controller, a digital signal processor (DSP), a hardware accelerator, and a high-speed interface. It also includes a range of peripherals, such as an I2C, SPI, UART, and USB 2.0 interface.
The chip operates at a power consumption of up to 1.2W, making it suitable for battery-powered applications. It also has a wide operating temperature range of -40°C to +85°C, and a wide range of I/O voltages from 1.8V to 5V.
The LFX1200EC-03F900I is suitable for a variety of embedded applications, such as industrial control, consumer electronics, automotive applications, and medical devices. It is also well suited for applications that require low-power, low-cost, and high-performance solutions. With its wide range of features, the LFX1200EC-03F900I is an ideal solution for embedded applications.
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4,385 In Stock
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