MPF300TS-FC784M
MPF300TS-FC784M
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Microchip

MPF300TS-FC784M


MPF300TS-FC784M
F8-MPF300TS-FC784M
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MPF300TS-FC784M
784-FCBGA (29x29)

MPF300TS-FC784M ECAD Model


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MPF300TS-FC784M Attributes


Type Description Select
Mfr Microchip Technology
Series PolarFire™
Package Tray
Number of Logic Elements/Cells 300000
Total RAM Bits 21600666
Number of I/O 388
Voltage - Supply 0.97V ~ 1.08V
Mounting Type Surface Mount
Operating Temperature -55°C ~ 125°C (TJ)
Package / Case 784-BBGA, FCBGA
Supplier Device Package 784-FCBGA (29x29)

MPF300TS-FC784M Datasheet Download


MPF300TS-FC784M Overview



The MPF300TS-FC784M is an advanced, high-performance, mixed-signal field programmable gate array (FPGA) manufactured by Microsemi Corporation. It is designed to provide a wide range of flexibility and performance for a variety of embedded applications.


The MPF300TS-FC784M is a high-performance, low-power FPGA with an integrated hard core processor, a high speed serial transceiver, and a high-density memory subsystem. It is capable of operating at up to 350 MHz with a total power consumption of less than 3.5 watts. The FPGA also features a wide range of I/O options, including LVDS, LVCMOS, and SERDES.


The MPF300TS-FC784M is ideal for a wide range of applications, including industrial automation, medical, automotive, and aerospace. It is also suitable for high-speed data processing, wireless communications, and signal processing applications. The FPGA is also capable of providing a high degree of flexibility and scalability for next-generation embedded systems.


The MPF300TS-FC784M is available in a range of packages, including BGA, PQFP, and VFBGA. It is compliant with the JEDEC standards, and is RoHS compliant. It also has an extended temperature range of -40 to +85°C, making it suitable for use in harsh environments.


Overall, the MPF300TS-FC784M is a powerful, high-performance FPGA with a wide range of features and capabilities. It is an ideal solution for a variety of embedded applications, and is capable of providing a high degree of flexibility, scalability, and performance.



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