XC2S200E-6FG456C

The XC2S200E-6FG456C is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is a low-cost and low-power FPGA device designed for a wide range of applications. The chip is based on the Xilinx Spartan-IIE family of FPGAs and is available in a 6mm x 6mm, 0.5mm pitch, 256-pin, Flip-Chip Ball Grid Array (FBGA) package. It contains 200K system gates, 8K bits of distributed RAM, and up to 4 dedicated multipliers. It has an operating temperature range of 0°C to 70°C and can be used in industrial and commercial environments.

The chip is ideal for applications such as embedded control, signal processing, and data communications. It is well-suited for use in automotive, industrial, medical, and consumer applications. It provides high performance, low power consumption, and fast time-to-market. The chip features advanced FPGA technology with features such as low-skew clock distribution, high-speed SERDES transceivers, and dedicated multipliers.

The XC2S200E-6FG456C also features enhanced system-level integration capabilities, including a high-speed serial interface, a high-speed interconnect, and an integrated power-management system. It also offers a wide range of configurable options, including multiple I/O standards, multiple clock sources, and multiple power-management options.

The XC2S200E-6FG456C is a versatile, low-cost, and low-power FPGA device suitable for a wide range of applications. It provides high performance, low power consumption, and fast time-to-market. The chip is designed to meet the requirements of many different applications and offers a wide range of configurable options.