XC2V8000-5FF1152C
XC2V8000-5FF1152C ECAD Model
XC2V8000-5FF1152C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 824 | |
| Number of Outputs | 824 | |
| Number of Logic Cells | 104832 | |
| Number of Equivalent Gates | 8000000 | |
| Number of CLBs | 11648 | |
| Combinatorial Delay of a CLB-Max | 390 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 11648 CLBS, 8000000 GATES | |
| Clock Frequency-Max | 750 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152 | |
| Pin Count | 1152 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC2V8000-5FF1152C Datasheet Download
XC2V8000-5FF1152C Overview
The XC2V8000-5FF1152C chip model is a powerful integrated circuit designed for high-performance applications such as digital signal processing, embedded processing, and image processing. It is able to process large amounts of data quickly and accurately, making it a great choice for applications that require fast and reliable performance. The chip model is designed to be programmed using the HDL (Hardware Description Language) language, which allows developers to create complex logic systems that can be implemented on the chip.
The original design intention of the XC2V8000-5FF1152C chip model was to provide a powerful and reliable solution for digital signal processing, embedded processing, and image processing. The chip model is highly scalable, meaning that it can be upgraded in the future to meet the needs of more advanced applications. It is also capable of being used in advanced communication systems, such as those used in 5G networks and other high-speed applications.
The XC2V8000-5FF1152C chip model can also be used to develop and popularize future intelligent robots. This chip model can be used to create sophisticated logic systems that can be used to control robotic systems. To use the model effectively, developers need to have a strong understanding of the HDL language and its capabilities. Additionally, they need to have experience with embedded systems and robotics in order to create robust and reliable robotic systems.
In conclusion, the XC2V8000-5FF1152C chip model is a powerful and reliable integrated circuit designed for high-performance applications. It is highly scalable and can be used in advanced communication systems, as well as in the development and popularization of future intelligent robots. To use the model effectively, developers need to have a strong understanding of the HDL language and experience with embedded systems and robotics.
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