XC2V8000-5FF1517C
XC2V8000-5FF1517C ECAD Model
XC2V8000-5FF1517C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 1108 | |
| Number of Outputs | 1108 | |
| Number of Logic Cells | 104832 | |
| Number of Equivalent Gates | 8000000 | |
| Number of CLBs | 11648 | |
| Combinatorial Delay of a CLB-Max | 390 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 11648 CLBS, 8000000 GATES | |
| Clock Frequency-Max | 750 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1 MM PITCH, MS-034AAU-1, FLIP CHIP, FBGA-1517 | |
| Pin Count | 1517 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC2V8000-5FF1517C Datasheet Download
XC2V8000-5FF1517C Overview
The Xilinx XC2V8000-5FF1517C chip model is a highly advanced and versatile integrated circuit that has been designed to meet the needs of a wide range of applications. It is a field-programmable gate array (FPGA) that can be used to implement complex digital designs with maximum flexibility and performance. The chip model is ideal for advanced communication systems, as it is able to process high-speed data streams with ease.
The XC2V8000-5FF1517C chip model was developed with the intention of providing users with a powerful and reliable platform for the development of advanced communication systems. It features a high-performance 32-bit processor, a wide range of configurable memory interfaces, and a large number of I/O pins. The chip model also includes a high-speed data transceiver, which allows for the transmission of data at speeds up to 8.5 gigabits per second.
The XC2V8000-5FF1517C chip model can be used for a variety of applications, including the development of advanced communication systems, the implementation of complex digital designs, and the development of intelligent robots. In order to make full use of the chip model, users should have a good understanding of digital design principles and be familiar with the Xilinx development tools. Additionally, the chip model can be upgraded in the future, allowing users to take advantage of the latest technologies and features.
The XC2V8000-5FF1517C chip model is a powerful and reliable platform for the development of advanced communication systems and the implementation of complex digital designs. It is capable of processing high-speed data streams with ease and can be upgraded in the future to take advantage of the latest technologies and features. Additionally, the chip model can be used to develop intelligent robots, although users should have a good understanding of digital design principles and be familiar with the Xilinx development tools in order to make full use of the chip model.
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|---|---|---|
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