XC3SD1800A-4FGG676C

The XC3SD1800A-4FGG676C is an FPGA chip manufactured by Xilinx. It is a low-cost, low-power device with a 676-pin FineLine BGA package. The device has a total of 1800 logic cells and is designed for use in a wide range of applications.

The chip has a range of features designed to enable it to meet the needs of a variety of applications. It has a wide variety of I/O options, including LVDS, SSTL, GTL, and LVCMOS. It also has a range of built-in memory blocks, including RAM, ROM, and FIFO.

The chip has a high-performance, low-power architecture that allows it to operate at up to 300 MHz. It also has a range of power-saving features, such as dynamic power management, clock gating, and power-down modes.

The XC3SD1800A-4FGG676C is suitable for use in a wide range of applications, including embedded systems, communications, imaging, and signal processing. It can be used in applications such as data acquisition, control, and signal processing. It is also suitable for use in high-speed data transfer, networking, and storage applications.

In summary, the XC3SD1800A-4FGG676C is a low-cost, low-power FPGA chip with a range of features designed to meet the needs of a variety of applications. It has a wide variety of I/O options, built-in memory blocks, and a high-performance, low-power architecture. It is suitable for use in a wide range of applications, including embedded systems, communications, imaging, and signal processing.