XC4003E-2PG120I
XC4003E-2PG120I
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rohs
Xilinx

XC4003E-2PG120I


XC4003E-2PG120I
F20-XC4003E-2PG120I
Active
IC FPGA 80 I/O 120CPGA
120-CPGA (34.54x34.54)

XC4003E-2PG120I ECAD Model


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XC4003E-2PG120I Attributes


Type Description Select
Mfr AMD Xilinx
Series XC4000E/X
Package Tray
Number of LABs/CLBs 100
Number of Logic Elements/Cells 238
Total RAM Bits 3200
Number of I/O 80
Number of Gates 3000
Voltage - Supply 4.5V ~ 5.5V
Mounting Type Through Hole
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 120-BCPGA
Supplier Device Package 120-CPGA (34.54x34.54)
Base Product Number XC4003E

XC4003E-2PG120I Datasheet Download


XC4003E-2PG120I Overview



The XC4003E-2PG120I is an FPGA chip model manufactured by Xilinx. It is a low-cost, low-power Field Programmable Gate Array (FPGA) chip that is suitable for a wide range of applications. It is a member of the XC4000E family of FPGAs and is based on the Virtex-4 architecture. The chip features a total of 120 I/O pins, with up to 8.5 million system gates and up to 6.5 Mb of embedded memory. It also has an array of dedicated logic blocks and dedicated I/O blocks for easy integration into various applications.


The XC4003E-2PG120I is designed for a range of applications including data processing, digital signal processing, networking and communications, and embedded systems. It can be used for image processing, video processing, audio processing, data acquisition, control systems, and embedded systems. It also supports high-speed serial transceivers, high-speed I/O, and high-speed memory interfaces. It is ideal for applications that require high performance, low power consumption, and small form factor.


The XC4003E-2PG120I is a highly reliable chip with a wide temperature range of -40°C to +85°C. It has a maximum operating frequency of up to 400 MHz and a maximum power consumption of 3.3 W. It is also RoHS compliant and has a maximum package size of 12 x 12 mm.


In summary, the XC4003E-2PG120I is a low-cost, low-power FPGA chip that is suitable for a variety of applications. It features a total of 120 I/O pins, up to 8.5 million system gates and up to 6.5 Mb of embedded memory. It is highly reliable and has a wide temperature range and a maximum operating frequency of up to 400 MHz. It is also RoHS compliant and has a maximum package size of 12 x 12 mm.



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