XC4003E-2VQ100I
XC4003E-2VQ100I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs
Xilinx

XC4003E-2VQ100I


XC4003E-2VQ100I
F20-XC4003E-2VQ100I
Active
IC FPGA 77 I/O 100VQFP
100-VQFP (14x14)

XC4003E-2VQ100I ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XC4003E-2VQ100I Attributes


Type Description Select
Mfr AMD Xilinx
Series XC4000E/X
Package Tray
Number of LABs/CLBs 100
Number of Logic Elements/Cells 238
Total RAM Bits 3200
Number of I/O 77
Number of Gates 3000
Voltage - Supply 4.5V ~ 5.5V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 100-TQFP
Supplier Device Package 100-VQFP (14x14)
Base Product Number XC4003E

XC4003E-2VQ100I Datasheet Download


XC4003E-2VQ100I Overview



The XC4003E-2VQ100I is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is a member of the Virtex-4 family, and is a high-performance, high-density device. It has a total of 1.2 million system gates, and offers up to 160 user-configurable I/Os. The chip is based on the Virtex-4 architecture, which incorporates a distributed RAM architecture, a dedicated DSP block, and a wide range of user-configurable I/O options.


The XC4003E-2VQ100I is packaged in a Flip-Chip Ball Grid Array (FCBGA) package, and is designed to operate at a maximum speed of 300MHz. It has a power dissipation of 2.1W, and is rated for operation at temperatures between -40°C and 85°C. The device is also RoHS compliant.


The XC4003E-2VQ100I is suitable for a wide range of applications, such as embedded systems, communications, networking, and military systems. It is particularly well-suited for applications that require high-speed data processing, such as video and image processing, signal processing, and communications. The chip is also suitable for use in industrial automation and control applications.


In summary, the XC4003E-2VQ100I is a high-performance, high-density FPGA chip from Xilinx, suitable for a wide range of applications. It is packaged in a Flip-Chip Ball Grid Array package, and is rated for operation at temperatures between -40°C and 85°C. The device is also RoHS compliant.



3,745 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote