XC6SLX100-2FGG676C

The XC6SLX100-2FGG676C chip is a Field Programmable Gate Array (FPGA) from Xilinx. It is a mid-range FPGA with 100,000 logic cells and 676 I/O pins. It is built on the 28nm process and uses the 6 series architecture. The chip has a maximum operating frequency of 500 MHz and a total power dissipation of 11.3 W. It also has a maximum memory of 1.8 Mbits and can support up to 28 Kbits of distributed RAM.

The XC6SLX100-2FGG676C chip has a wide range of applications. It is used in industrial automation, medical imaging, automotive safety systems, and other embedded applications. It is also used in aerospace and defense applications, such as radar and communication systems. Additionally, it is used in data acquisition systems, high-speed communication systems, and various other applications.

The XC6SLX100-2FGG676C chip is designed to meet the needs of system designers who require high performance and low power consumption. It is also designed for flexibility and scalability, allowing for the integration of multiple FPGAs into a single system. Additionally, it is designed to be highly reliable and efficient, allowing for improved system performance and reliability.