XC6SLX100-3FG676C

The XC6SLX100-3FG676C is a FPGA (Field Programmable Gate Array) chip from Xilinx. It is a low-cost, low-power, small form factor device, making it suitable for a variety of applications. The chip is made on a 6-layer, 0.5mm pitch, lead-free, RoHS-compliant, 676-pin BGA package.

The XC6SLX100-3FG676C has a total of 100,000 logic cells, with a total power consumption of 1.3 W. It also has 8 DSP slices, 4 Block RAMs, and 4 Multipliers. It supports a wide variety of I/O standards such as LVDS, LVCMOS, SSTL2, and HSTL. It also supports a wide range of clock speeds, ranging from 200MHz to 500MHz.

The XC6SLX100-3FG676C is ideal for applications such as industrial automation, medical imaging, communications, and consumer electronics. It is also suitable for applications that require low power consumption and small form factor, such as wearable devices, portable devices, and embedded systems.

Overall, the XC6SLX100-3FG676C is a low-cost, low-power, small form factor FPGA chip that is suitable for a variety of applications. It has a wide range of I/O standards and clock speeds, making it a great choice for applications that require low power consumption and small form factor.