XC6SLX150T-N3FG900C
XC6SLX150T-N3FG900C
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Xilinx

XC6SLX150T-N3FG900C


XC6SLX150T-N3FG900C
F20-XC6SLX150T-N3FG900C
Active
IC FPGA 540 I/O 900FBGA
900-FBGA (31x31)

XC6SLX150T-N3FG900C ECAD Model


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XC6SLX150T-N3FG900C Attributes


Type Description Select
Mfr AMD Xilinx
Series Spartan®-6 LXT
Package Tray
Number of LABs/CLBs 11519
Number of Logic Elements/Cells 147443
Total RAM Bits 4939776
Number of I/O 540
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 900-BBGA
Supplier Device Package 900-FBGA (31x31)
Base Product Number XC6SLX150

XC6SLX150T-N3FG900C Datasheet Download


XC6SLX150T-N3FG900C Overview



The XC6SLX150T-N3FG900C is a Field Programmable Gate Array (FPGA) chip from Xilinx, Inc. It is a low-cost, low-power, high-performance device that is ideal for a wide range of applications.


The XC6SLX150T-N3FG900C has a total of 150,000 logic cells and 900 Kbits of embedded RAM. It also features a wide range of advanced features, including a low-power, low-cost Spartan-6 architecture, high-speed transceivers, integrated clock management, and a wide range of I/O options.


The XC6SLX150T-N3FG900C is designed to meet the needs of a wide range of applications, including embedded systems, industrial automation, automotive, medical, aerospace, and communications. It is also suitable for applications such as video processing, image processing, and artificial intelligence.


The XC6SLX150T-N3FG900C is a highly reliable device, with an operating temperature range of -40°C to +100°C and a maximum operating frequency of 300 MHz. It is also capable of handling up to 3.3V I/O, and has a wide range of I/O options, including LVDS, LVCMOS, and differential I/O.


In addition, the XC6SLX150T-N3FG900C has an on-board JTAG debugging interface and is supported by the Xilinx ISE Design Suite, which provides a comprehensive set of tools for the development of FPGA-based designs.


Overall, the XC6SLX150T-N3FG900C is an ideal choice for a wide range of applications, offering low-cost, low-power, and high-performance capabilities.



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