

XC6SLX75-N3FG676I
XC6SLX75-N3FG676I ECAD Model
XC6SLX75-N3FG676I Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Spartan®-6 LX | |
Package | Tray | |
Number of LABs/CLBs | 5831 | |
Number of Logic Elements/Cells | 74637 | |
Total RAM Bits | 3170304 | |
Number of I/O | 408 | |
Voltage - Supply | 1.14V ~ 1.26V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 676-BGA | |
Supplier Device Package | 676-FBGA (27x27) | |
Base Product Number | XC6SLX75 |
XC6SLX75-N3FG676I Datasheet Download
XC6SLX75-N3FG676I Overview
The XC6SLX75-N3FG676I is a Xilinx Spartan-6 FPGA chip, designed for high-performance applications. It is a low-cost, low-power FPGA with a maximum power dissipation of 4.3W. It has a total of 675 logic cells, 676 Registers and 675 Flip-Flops. The device is equipped with a maximum of 28Kbits of distributed RAM, and is able to support up to 4.2Mbits of external memory. It also includes a total of 40 user I/O pins, with support for up to four high-speed serial transceivers. The XC6SLX75-N3FG676I is suitable for a wide range of applications, including embedded systems, industrial control, automotive systems, medical equipment, and consumer electronics. It is also suitable for high-speed data processing, image and video processing, and signal processing. It is capable of supporting high-speed digital signal processing (DSP) applications, with a maximum clock frequency of 200MHz. The XC6SLX75-N3FG676I is equipped with a range of features, including a low-power design, low-cost, high-performance, and high-density integration. It is also capable of supporting multiple power domains, as well as on-chip debugging capabilities. In addition, it is also compatible with a range of development tools, such as Xilinx ISE, Vivado, and System Generator. In conclusion, the XC6SLX75-N3FG676I is a low-cost, low-power FPGA chip, suitable for a wide range of applications. It is equipped with a range of features, including a low-power design, low-cost, high-performance, and high-density integration. It is also capable of supporting multiple power domains, as well as on-chip debugging capabilities.