XC6SLX75-N3FGG676I
XC6SLX75-N3FGG676I
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Xilinx

XC6SLX75-N3FGG676I


XC6SLX75-N3FGG676I
F20-XC6SLX75-N3FGG676I
Active
IC FPGA 408 I/O 676FBGA
676-FBGA (27x27)

XC6SLX75-N3FGG676I ECAD Model


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XC6SLX75-N3FGG676I Attributes


Type Description Select
Mfr AMD Xilinx
Series Spartan®-6 LX
Package Tray
Number of LABs/CLBs 5831
Number of Logic Elements/Cells 74637
Total RAM Bits 3170304
Number of I/O 408
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Base Product Number XC6SLX75

XC6SLX75-N3FGG676I Datasheet Download


XC6SLX75-N3FGG676I Overview



The XC6SLX75-N3FGG676I is a FPGA (Field Programmable Gate Array) chip model from Xilinx. It is a high-performance, low-cost device that can be used for a variety of applications. It is part of the Spartan-6 family of FPGAs and is based on the 65nm low-power process technology. The XC6SLX75-N3FGG676I features 3.75 million system gates, up to 9,152 logic cells, and up to 576 Kbits of block RAM. It has a maximum clock frequency of 300MHz, and a maximum I/O count of 676. It supports up to four independent clock domains, and up to 8 global clock networks. It also supports a wide range of I/O standards, including LVTTL, LVCMOS, SSTL, and HSTL. The XC6SLX75-N3FGG676I is suitable for a wide range of applications, such as industrial automation, medical imaging, automotive, aerospace, and consumer electronics. It can be used for digital signal processing, image processing, and embedded systems. It is also suitable for high-speed networking, video and audio processing, and encryption. The XC6SLX75-N3FGG676I is a reliable and cost-effective FPGA chip model that can be used for a variety of applications. It is easy to configure, has high performance, and is suitable for a wide range of applications.


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